Teruhiro Nakamiya

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit copper overlay for temperature management
- Patent number 11,924,958
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit offset finger stiffener
- Patent number 11,657,841
- Issue date May 23, 2023
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Hard disk drive suspension tail having narrowing tip
- Patent number 11,430,474
- Issue date Aug 30, 2022
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Multilayer flex circuit with non-plated outer metal layer
- Patent number 11,419,213
- Issue date Aug 16, 2022
- Western Digital Technologies, Inc.
- Nobumasa Nishiyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Flex-HGA connector assembly for hard disk drive
- Patent number 9,704,520
- Issue date Jul 11, 2017
- Western Digital Technologies, Inc.
- Shigeo Nakamura
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT
- Publication number 20230276566
- Publication date Aug 31, 2023
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT OFFSET FINGER STIFFENER
- Publication number 20220415346
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Application
FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT
- Publication number 20220418078
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Application
MULTILAYER FLEX CIRCUIT WITH NON-PLATED OUTER METAL LAYER
- Publication number 20200315014
- Publication date Oct 1, 2020
- Western Digital Technologies, Inc.
- Nobumasa Nishiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR