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last 30 patents
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Patent Grant
Plating device and plating method
Patent number
7,544,274
Issue date
Jun 9, 2009
Dowa Metaltech Co., Ltd.
Hiroshi Miyazawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
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Patent Application
Plating device and plating method
Publication number
20060137987
Publication date
Jun 29, 2006
DOWA MINING CO., LTD.
Hiroshi Miyazawa
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR