Terumasa Moriyama

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,123,433
- Issue date Nov 6, 2018
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier
- Patent number 9,788,423
- Issue date Oct 10, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil with carrier, method of producing same, copper foil wit...
- Patent number 9,578,741
- Issue date Feb 21, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil for printed wiring board, method for producing said cop...
- Patent number 9,028,972
- Issue date May 12, 2015
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil for printed circuit board and copper clad laminate for...
- Patent number 8,142,905
- Issue date Mar 27, 2012
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SURFACE TREATMENT METAL POWDER FOR LASER SINTERING
- Publication number 20190240729
- Publication date Aug 8, 2019
- JX NIPPON MINING & METALS CORPORATION
- Hideki FURUSAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metal Foil, Metal Foil Having Release Layer, Laminated Material, Pr...
- Publication number 20180264783
- Publication date Sep 20, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...
- Publication number 20180255646
- Publication date Sep 6, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...
- Publication number 20180228029
- Publication date Aug 9, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Pr...
- Publication number 20170032978
- Publication date Feb 2, 2017
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Pr...
- Publication number 20170034926
- Publication date Feb 2, 2017
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...
- Publication number 20160374205
- Publication date Dec 22, 2016
- JX NIPPON MINING & METALS CORPORATION
- TERUMASA MORIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20160242281
- Publication date Aug 18, 2016
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil with Carrier, Method of Producing Same, Copper Foil wit...
- Publication number 20150047884
- Publication date Feb 19, 2015
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLE...
- Publication number 20140030591
- Publication date Jan 30, 2014
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COP...
- Publication number 20130220685
- Publication date Aug 29, 2013
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING COPPER FOIL FOR PRINTED WIRING BOARD, AND C...
- Publication number 20130189538
- Publication date Jul 25, 2013
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20120148862
- Publication date Jun 14, 2012
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil for Printed Circuit Board and Copper Clad Laminate for...
- Publication number 20100261033
- Publication date Oct 14, 2010
- Nippon Mining & Metals Co., Ltd.
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Terumasa Moriyama

Person

Patents Grantslast 30 patents

Surface-treated copper foil, copper foil having carrier, laminated...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Copper foil with carrier

Copper foil with carrier, method of producing same, copper foil wit...

Copper foil for printed wiring board, method for producing said cop...

Copper foil for printed circuit board and copper clad laminate for...

Patents Applicationslast 30 patents

SURFACE TREATMENT METAL POWDER FOR LASER SINTERING

Metal Foil, Metal Foil Having Release Layer, Laminated Material, Pr...

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...

Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Pr...

Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Pr...

COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...

COPPER FOIL WITH CARRIER

Copper Foil with Carrier, Method of Producing Same, Copper Foil wit...

ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLE...

COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COP...

METHOD OF MANUFACTURING COPPER FOIL FOR PRINTED WIRING BOARD, AND C...

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...

Copper Foil for Printed Circuit Board and Copper Clad Laminate for...