Terumitsu Santo

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Gojo-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor laser device and wire bonding method capable of easil...
- Patent number 6,784,464
- Issue date Aug 31, 2004
- Sharp Kabushiki Kaisha
- Hideki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device and wire bonding method capable of easil...
- Patent number 6,562,693
- Issue date May 13, 2003
- Sharp Kabushiki Kaisha
- Hideki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus
- Patent number 6,142,356
- Issue date Nov 7, 2000
- Sharp Kabushiki Kaisha
- Masao Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor laser device and wire bonding method capable of easil...
- Publication number 20030165167
- Publication date Sep 4, 2003
- Sharp Kabushiki Kaisha
- Hideki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor laser device and wire bonding method capable of easil...
- Publication number 20010026991
- Publication date Oct 4, 2001
- Hideki Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS