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Terunari Takano
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Higashiusuki-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device manufacturing method for reinforcing chip by u...
Patent number
6,777,313
Issue date
Aug 17, 2004
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package for a semiconductor device comprising a plurality of interc...
Patent number
6,545,348
Issue date
Apr 8, 2003
Kabushiki Kaisha Toshiba
Terunari Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
Patent number
6,326,243
Issue date
Dec 4, 2001
Kabushiki Kaisha Toshiba
Nobuhito Suzuya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealed semiconductor device including a die pad uniformly hav...
Patent number
5,753,969
Issue date
May 19, 1998
Kabushiki Kaisha Toshiba
Nobuhito Suzuya
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor device manufacturing method for reinforcing chip by u...
Publication number
20030017663
Publication date
Jan 23, 2003
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS