TREA

Teruo HAIBARA

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  • Saitama, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240297142
    • Publication date Sep 5, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290743
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290745
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290744
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230215834
    • Publication date Jul 6, 2023
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR D...
    • Publication number 20230154884
    • Publication date May 18, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230146315
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20230142531
    • Publication date May 11, 2023
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230018430
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    AL BONDING WIRE
    • Publication number 20220152749
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE
    • Publication number 20220157766
    • Publication date May 19, 2022
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20220108971
    • Publication date Apr 7, 2022
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20200312808
    • Publication date Oct 1, 2020
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
    • Publication number 20200013747
    • Publication date Jan 9, 2020
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
    • Publication number 20190164927
    • Publication date May 30, 2019
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20180374816
    • Publication date Dec 27, 2018
    • Nippon Micrometal Corporation
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180133843
    • Publication date May 17, 2018
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180130763
    • Publication date May 10, 2018
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180122765
    • Publication date May 3, 2018
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    METHOD FOR FORMING BALL IN BONDING WIRE
    • Publication number 20180096965
    • Publication date Apr 5, 2018
    • NIPPON MICROMETAL CORPORATION
    • Noritoshi ARAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170323864
    • Publication date Nov 9, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
    • Publication number 20170287861
    • Publication date Oct 5, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170216974
    • Publication date Aug 3, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170200689
    • Publication date Jul 13, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170194280
    • Publication date Jul 6, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170117244
    • Publication date Apr 27, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
    • Publication number 20160111389
    • Publication date Apr 21, 2016
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...