Teruo Kawada

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Reflow-plated member and a manufacturing method therefor
- Patent number 5,614,328
- Issue date Mar 25, 1997
- The Furukawa Electric Co. Ltd.
- Satoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR