Teruyoshi HISADA

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,603,248
- Issue date Mar 21, 2017
- Ibiden Co., Ltd.
- Teruyoshi Hisada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE TREATMENT APPARATUS AND METHOD FOR NUFACTURING SURFACE-TREA...
- Publication number 20150017328
- Publication date Jan 15, 2015
- IBIDEN CO., LTD.
- Takashi Nakane
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140041923
- Publication date Feb 13, 2014
- IBIDEN CO., LTD.
- Teruyoshi HISADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR