TERUYUKI HOTTA

Person

OSAKA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treating device
- Patent number 11,001,936
- Issue date May 11, 2021
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treating apparatus
- Patent number 9,359,676
- Issue date Jun 7, 2016
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treating apparatus
- Patent number 9,120,113
- Issue date Sep 1, 2015
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,276,270
- Issue date Oct 2, 2012
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a circuit pattern
- Patent number 8,262,831
- Issue date Sep 11, 2012
- C. Uyemura & Co., Ltd.
- Shigeo Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless plating solution, method for electroless plating using...
- Patent number 8,197,583
- Issue date Jun 12, 2012
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating solution, method for electroless plating using...
- Patent number 8,137,447
- Issue date Mar 20, 2012
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Analysis of tin, lead or tin-lead alloy plating solution
- Patent number 5,294,554
- Issue date Mar 15, 1994
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- G01 - MEASURING TESTING
Information Patent Grant
Bath and method for the electroless plating of tin and tin-lead alloy
- Patent number 5,266,103
- Issue date Nov 30, 1993
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless plating tin, lead or tin-lead alloy
- Patent number 5,248,527
- Issue date Sep 28, 1993
- C. Uyemura and Company, Limited
- Hiroki Uchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal ion replenishment to plating bath
- Patent number 5,234,572
- Issue date Aug 10, 1993
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE TREATING DEVICE
- Publication number 20190301048
- Publication date Oct 3, 2019
- C. Uyemura & Co., Ltd.
- Teruyuki HOTTA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD...
- Publication number 20150289382
- Publication date Oct 8, 2015
- C. UYEMURA & CO., LTD
- Masaharu Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATING APPARATUS
- Publication number 20140116334
- Publication date May 1, 2014
- C. Uyemura & Co., Ltd.
- Teruyuki HOTTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE TREATING APPARATUS
- Publication number 20140053774
- Publication date Feb 27, 2014
- C. Uyemura & Co., Ltd.
- Teruyuki HOTTA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD
- Publication number 20130295294
- Publication date Nov 7, 2013
- C. Uyemura & Co., Ltd.
- Takahiro ISHIZAKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD
- Publication number 20130056362
- Publication date Mar 7, 2013
- C. Uyemura & Co., Ltd.
- Shinji TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...
- Publication number 20120058254
- Publication date Mar 8, 2012
- C. Uyemura & Co., Ltd.
- TERUYUKI HOTTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SU...
- Publication number 20110259373
- Publication date Oct 27, 2011
- C. UYEMURA CO., LTD
- Teruyuki Hotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A CIRCUIT PATTERN
- Publication number 20100243149
- Publication date Sep 30, 2010
- C. Uyemura & Co., Ltd.
- Shigeo Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20100181104
- Publication date Jul 22, 2010
- C. Uyemura & Co., Ltd.
- Teruyuki Hotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...
- Publication number 20100003399
- Publication date Jan 7, 2010
- C. Uyemura & Co., Ltd.
- TERUYUKI HOTTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD
- Publication number 20090092749
- Publication date Apr 9, 2009
- C. Uyemura & Co., Ltd.
- Shinji TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

TERUYUKI HOTTA

Person

Patents Grantslast 30 patents

Surface treating device

Surface treating apparatus

Surface treating apparatus

Method for manufacturing printed circuit board

Method for forming a circuit pattern

Electroless plating solution, method for electroless plating using...

Electroless plating solution, method for electroless plating using...

Analysis of tin, lead or tin-lead alloy plating solution

Bath and method for the electroless plating of tin and tin-lead alloy

Process for electroless plating tin, lead or tin-lead alloy

Metal ion replenishment to plating bath

Patents Applicationslast 30 patents

SURFACE TREATING DEVICE

PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD...

SURFACE TREATING APPARATUS

SURFACE TREATING APPARATUS

ELECTROLESS COPPER PLATING BATH AND ELECTROLESS COPPER PLATING METHOD

MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD

ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...

METHOD AND AGENT FOR SURFACE PROCESSING OF PRINTED CIRCUIT BOARD SU...

METHOD FOR FORMING A CIRCUIT PATTERN

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

ELECTROLESS PLATING SOLUTION, METHOD FOR ELECTROLESS PLATING USING...

MANUFACTURE METHOD OF BUILDUP CIRCUIT BOARD