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LEAD FRAME, AND SEMICONDUCTOR DEVICE
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SUBSTRATE-WITH-SUPPORT
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Publication number 20190221505
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Shinko Electric Industries Co., Ltd.
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WIRING SUBSTRATE
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Publication date Nov 15, 2018
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Shinko Electric Industries Co., Ltd.
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Tetsuichiro KASAHARA
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LEAD FRAME AND SEMICONDUCTOR DEVICE
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PROCESS FOR MANUFACTURING IC CARD
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