Tetsuji Hori

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Mounting material, semiconductor device and method of manufacturing...
- Patent number 6,949,814
- Issue date Sep 27, 2005
- Kabushiki Kaisha Toshiba
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, device using the same and manufacturing process th...
- Patent number 6,673,310
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 6,469,398
- Issue date Oct 22, 2002
- Kabushiki Kaisha Toshiba
- Tetsuji Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device provided with heat-sink and method of manufact...
- Patent number 6,225,701
- Issue date May 1, 2001
- Kabushiki Kaisha Toshiba
- Tetsuji Hori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mounting material, semiconductor device and method of manufacturing...
- Publication number 20030111728
- Publication date Jun 19, 2003
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030057573
- Publication date Mar 27, 2003
- Kabushiki Kaisha Toshiba
- Toshitaka Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20020140067
- Publication date Oct 3, 2002
- Tetsuji Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder material, device using the same and manufacturing process th...
- Publication number 20010029095
- Publication date Oct 11, 2001
- Masahiro Tadauchi
- H01 - BASIC ELECTRIC ELEMENTS