Tetsuji Ishida

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Hirakata-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Pretreatment agent for electroless plating, and pretreatment and pr...
- Patent number 10,138,558
- Issue date Nov 27, 2018
- C. Uyemura & Co., Ltd.
- Yoshikazu Saijo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst application solution, electroless plating method using sam...
- Patent number 8,828,131
- Issue date Sep 9, 2014
- C. Uyemura & Co., Ltd.
- Hisamitsu Yamamoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING PLATING DEPOSIT
- Publication number 20240351943
- Publication date Oct 24, 2024
- C. Uyemura & Co., Ltd.
- Takuya Komeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ETCHING SOLUTION
- Publication number 20220389592
- Publication date Dec 8, 2022
- C. Uyemura & Co., Ltd.
- Takuya Komeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pretreatment Method for Electroless Plating, and Pretreatment Solut...
- Publication number 20220275516
- Publication date Sep 1, 2022
- Tetsuji Ishida
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PR...
- Publication number 20180023197
- Publication date Jan 25, 2018
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST APPLICATION SOLUTION, ELECTROLESS PLATING METHOD USING SAM...
- Publication number 20120171363
- Publication date Jul 5, 2012
- C. UYEMURA & CO., LTD
- Hisamitsu Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR