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Tetsuji ISHIKAWA
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Kawasaki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Power-demand-value calculating system, power-demand-value calculati...
Patent number
10,989,743
Issue date
Apr 27, 2021
Fujitsu Limited
Masayuki Kitajima
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Joining method and reflow apparatus
Patent number
8,434,658
Issue date
May 7, 2013
Fujitsu Limited
Tetsuji Ishikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Joining method and reflow apparatus
Patent number
7,975,898
Issue date
Jul 12, 2011
Fujitsu Limited
Tetsuji Ishikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heating apparatus
Patent number
7,661,573
Issue date
Feb 16, 2010
Fujitsu Limited
Osamu Saito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of removing integrated circuit chip package and detachment j...
Patent number
7,469,457
Issue date
Dec 30, 2008
Fujitsu Limited
Tetsuji Ishikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
POWER-DEMAND-VALUE CALCULATING SYSTEM, POWER-DEMAND-VALUE CALCULATI...
Publication number
20180321288
Publication date
Nov 8, 2018
Fujitsu Limited
Masayuki Kitajima
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
ORDERING PROGRAM, ORDERING DEVICE, AND ORDERING METHOD
Publication number
20170032448
Publication date
Feb 2, 2017
Fujitsu Limited
Masayuki Kitajima
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
JOINING METHOD AND REFLOW APPARATUS
Publication number
20110192536
Publication date
Aug 11, 2011
Fujitsu Limited
Tetsuji ISHIKAWA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
JOINING METHOD AND REFLOW APPARATUS
Publication number
20100170939
Publication date
Jul 8, 2010
FUJITSU LIMITED
Tetsuji ISHIKAWA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method and apparatus for rework soldering
Publication number
20090289100
Publication date
Nov 26, 2009
FUJITSU LIMITED
Tetsuji Ishikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDERING METHOD AND APPARATUS FOR MOUNTING DEVICES ON PRINTED CIRC...
Publication number
20090084831
Publication date
Apr 2, 2009
FUJITSU LIMITED
Tetsuji Ishikawa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for manufacturing product involving solder joining, solder j...
Publication number
20090020588
Publication date
Jan 22, 2009
FUJITSU LIMITED
Osamu Saito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board unit and printed wiring board
Publication number
20080225500
Publication date
Sep 18, 2008
FUJITSU LIMITED
Yasuhide Kuroda
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PASTE PRINTER AND METHOD OF PRINTING WITH PASTE
Publication number
20080145972
Publication date
Jun 19, 2008
Fujitsu Limited
Tetsuji ISHIKAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Heating apparatus
Publication number
20060273141
Publication date
Dec 7, 2006
FUJITSU LIMITED
Osamu Saito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of removing integrated circuit chip package and detachment j...
Publication number
20060107513
Publication date
May 25, 2006
FUJITSU LIMITED
Tetsuji Ishikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR