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Tetsukazu Sugiya

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200111658
    • Publication date Apr 9, 2020
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20190027408
    • Publication date Jan 24, 2019
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER
    • Publication number 20180226295
    • Publication date Aug 9, 2018
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170271208
    • Publication date Sep 21, 2017
    • Disco Corporation
    • Hideki Koshimizu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170069537
    • Publication date Mar 9, 2017
    • Disco Corporation
    • Tetsukazu Sugiya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20170053830
    • Publication date Feb 23, 2017
    • Disco Corporation
    • Takashi Haimoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160064230
    • Publication date Mar 3, 2016
    • Disco Corporation
    • Ryosuke Nishihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR PROCESSING PLATE OBJECT
    • Publication number 20140183163
    • Publication date Jul 3, 2014
    • Disco Corporation
    • Tetsukazu Sugiya
    • B24 - GRINDING POLISHING