Tetsuo Fukada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,335,570
- Issue date Jan 1, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thin copper film and semiconductor device with th...
- Patent number 6,303,495
- Issue date Oct 16, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Takeshi Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having interconnect layer and method of manufa...
- Patent number 6,215,189
- Issue date Apr 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiko Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making embedded wiring system
- Patent number 6,184,124
- Issue date Feb 6, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Makiko Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection and adhesion layers
- Patent number 6,107,687
- Issue date Aug 22, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuo Fukada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CVD apparatus for Cu formation
- Patent number 6,039,808
- Issue date Mar 21, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiko Toyoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 5,892,286
- Issue date Apr 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiko Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel embedded wiring system
- Patent number 5,793,112
- Issue date Aug 11, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Makiko Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device with multilayer interconnection structure
- Publication number 20030222349
- Publication date Dec 4, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Shingo Tomohisa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20010045652
- Publication date Nov 29, 2001
- TAKESHI MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THIN COPPER FILM
- Publication number 20010019847
- Publication date Sep 6, 2001
- TAKESHI MORI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tetsuo Fukada

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Method of forming thin copper film and semiconductor device with th...

Semiconductor device having interconnect layer and method of manufa...

Method of making embedded wiring system

Semiconductor device having interconnection and adhesion layers

CVD apparatus for Cu formation

Semiconductor device and manufacturing method thereof

Multilevel embedded wiring system

Patents Applicationslast 30 patents

Semiconductor device with multilayer interconnection structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING THIN COPPER FILM