Tetsuo Hidaka

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Uji-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for processing resin sealed lead frame
- Patent number 6,258,628
- Issue date Jul 10, 2001
- Towa Corporation
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for processing resin sealed lead frame
- Publication number 20010021409
- Publication date Sep 13, 2001
- TOWA CORPORATION
- Michio Osada
- H01 - BASIC ELECTRIC ELEMENTS