TREA

Tetsuo Kubo

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Processing apparatus
    • Patent number 11,667,003
    • Issue date Jun 6, 2023
    • Disco Corporation
    • Nobuyuki Fukushi
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Grinding apparatus
    • Patent number 11,524,386
    • Issue date Dec 13, 2022
    • Disco Corporation
    • Souichi Matsubara
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Grinding apparatus
    • Patent number 10,522,373
    • Issue date Dec 31, 2019
    • Disco Corporation
    • Kazutaka Kuwana
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER GRINDING METHOD
    • Publication number 20220134504
    • Publication date May 5, 2022
    • Disco Corporation
    • Tetsuo KUBO
    • B24 - GRINDING POLISHING
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220055173
    • Publication date Feb 24, 2022
    • Disco Corporation
    • Nobuyuki FUKUSHI
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20200398400
    • Publication date Dec 24, 2020
    • Disco Corporation
    • Souichi MATSUBARA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20200316750
    • Publication date Oct 8, 2020
    • Disco Corporation
    • Souichi MATSUBARA
    • B24 - GRINDING POLISHING
  • Information Patent Application

    GRINDING APPARATUS
    • Publication number 20180204746
    • Publication date Jul 19, 2018
    • Disco Corporation
    • Kazutaka Kuwana
    • B24 - GRINDING POLISHING