Tetsuo Kumazawa

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 7,198,962
- Issue date Apr 3, 2007
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,566,150
- Issue date May 20, 2003
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,455,335
- Issue date Sep 24, 2002
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,297,073
- Issue date Oct 2, 2001
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof including a p...
- Patent number 6,197,603
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 6,130,112
- Issue date Oct 10, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,049,128
- Issue date Apr 11, 2000
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 5,837,567
- Issue date Nov 17, 1998
- Hitachi, Ltd.
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting structure of optical fiber to optical waveguide
- Patent number 5,671,316
- Issue date Sep 23, 1997
- Hitachi Cable, Ltd.
- Toshiya Yuhara
- G02 - OPTICS
Information Patent Grant
Lead frame and semiconductor device encapsulated by resin
- Patent number 5,637,914
- Issue date Jun 10, 1997
- Hitachi, Ltd.
- Naotaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device package having holes for electric...
- Patent number 5,608,265
- Issue date Mar 4, 1997
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electronic component assembly and electronic...
- Patent number 5,569,960
- Issue date Oct 29, 1996
- Hitachi, Ltd.
- Tetsuo Kumazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical coupling apparatus and manufacturing method of the same, an...
- Patent number 5,195,155
- Issue date Mar 16, 1993
- Hitachi, Ltd.
- Makoto Shimaoka
- G02 - OPTICS
Information Patent Grant
Semiconductor light emitting device and apparatus using the same
- Patent number 5,046,798
- Issue date Sep 10, 1991
- Hitachi, Ltd.
- Yasutoshi Yagiu
- G02 - OPTICS
Information Patent Grant
Opto-electronic device and method for producing the device
- Patent number 4,880,290
- Issue date Nov 14, 1989
- Hitachi, Ltd.
- Tetsuo Kumazawa
- G02 - OPTICS
Information Patent Grant
Composite fibrous product
- Patent number 4,528,223
- Issue date Jul 9, 1985
- Hitachi, Ltd.
- Tetsuo Kumazawa
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Laminates comprising prepregs metal clad
- Patent number 4,446,191
- Issue date May 1, 1984
- Hitachi Chemical Company, Ltd.
- Yasuo Miyadera
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mask support for shadow mask assembly
- Patent number 4,335,329
- Issue date Jun 15, 1982
- Hitachi, Ltd.
- Kenichi Fukuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-heated cathode structure
- Patent number 4,251,746
- Issue date Feb 17, 1981
- Hitachi, Ltd.
- Takao Kawamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof including a p...
- Publication number 20030203521
- Publication date Oct 30, 2003
- Ryuji Kohno
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method thereof including a p...
- Publication number 20020182796
- Publication date Dec 5, 2002
- Ryuji Kohno
- G01 - MEASURING TESTING

Tetsuo Kumazawa

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof including a p...

Semiconductor device and manufacturing method thereof including a p...

Semiconductor device and manufacturing method thereof including a p...

Semiconductor device

Semiconductor device and manufacturing method thereof including a p...

Semiconductor device

Semiconductor device

Lead frame and semiconductor device

Connecting structure of optical fiber to optical waveguide

Lead frame and semiconductor device encapsulated by resin

Encapsulated semiconductor device package having holes for electric...

Electronic component, electronic component assembly and electronic...

Optical coupling apparatus and manufacturing method of the same, an...

Semiconductor light emitting device and apparatus using the same

Opto-electronic device and method for producing the device

Composite fibrous product

Laminates comprising prepregs metal clad

Mask support for shadow mask assembly

Direct-heated cathode structure

Patents Applicationslast 30 patents

Semiconductor device and manufacturing method thereof including a p...

Semiconductor device and manufacturing method thereof including a p...