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Tetsuo Murakami
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Ebina-shi, JP
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Patents Grants
last 30 patents
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Patent Grant
Multi-axis laser machine, method for machining with the same, and r...
Patent number
7,164,099
Issue date
Jan 16, 2007
Hitachi Via Mechancis Ltd.
Izumi Hata
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump forming method and apparatus therefor
Patent number
6,460,755
Issue date
Oct 8, 2002
Hitachi, Ltd.
Kosuke Inoue
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board processing machine incorporating tool holding...
Patent number
5,205,805
Issue date
Apr 27, 1993
Hitachi Seiko Ltd.
Tamio Otani
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Contour machining method and apparatus for printed circuit board
Patent number
5,011,345
Issue date
Apr 30, 1991
Hitachi Seiko Co., Ltd.
Masao Nishigai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
Multi-axis laser machine, method for machining with the same, and r...
Publication number
20040173590
Publication date
Sep 9, 2004
Hitachi Via Mechanics Ltd.
Izumi Hata
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR