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Tetsuo Saji

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SENSOR CIRCUIT AND SENSING METHOD
    • Publication number 20180202976
    • Publication date Jul 19, 2018
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • G01 - MEASURING TESTING
  • Information Patent Application

    FRONT END CIRCUIT, MODULE, AND COMMUNICATION DEVICE
    • Publication number 20170272115
    • Publication date Sep 21, 2017
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    FILTER CIRCUIT, FRONT END CIRCUIT, AND MODULE
    • Publication number 20170264336
    • Publication date Sep 14, 2017
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20170013748
    • Publication date Jan 12, 2017
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FRONT END CIRCUIT, MODULE, AND COMMUNICATION DEVICE
    • Publication number 20160315653
    • Publication date Oct 27, 2016
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MULTILAYER CIRCUIT SUBSTRATE
    • Publication number 20150236393
    • Publication date Aug 20, 2015
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20150119104
    • Publication date Apr 30, 2015
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    COMMUNICATION MODULE
    • Publication number 20150119102
    • Publication date Apr 30, 2015
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
    • Publication number 20150098203
    • Publication date Apr 9, 2015
    • Taiyo Yuden Co., Ltd.
    • Tatsuro SAWATARI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
    • Publication number 20150070849
    • Publication date Mar 12, 2015
    • Taiyo Yuden Co., Ltd.
    • Masaya SHIMAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20150062835
    • Publication date Mar 5, 2015
    • Taiyo Yuden Co., Ltd.
    • Takehiko KAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20150049439
    • Publication date Feb 19, 2015
    • Taiyo Yuden Co., Ltd.
    • Masaya SHIMAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
    • Publication number 20150043172
    • Publication date Feb 12, 2015
    • Taiyo Yuden Co., Ltd.
    • Eiji MUGIYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND METHOD OF PRODUCING CIRCUIT MODULE
    • Publication number 20150044822
    • Publication date Feb 12, 2015
    • Taiyo Yuden Co., Ltd.
    • Eiji MUGIYA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
    • Publication number 20150043170
    • Publication date Feb 12, 2015
    • Taiyo Yuden Co., Ltd.
    • Masaya SHIMAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140349596
    • Publication date Nov 27, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH FREQUENCY CIRCUIT MODULE
    • Publication number 20140308906
    • Publication date Oct 16, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CIRCUIT SUBSTRATE
    • Publication number 20140299358
    • Publication date Oct 9, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT-EMBEDDED CIRCUIT SUBSTRATE AND METHOD OF INSPECTING THE SAME
    • Publication number 20140285213
    • Publication date Sep 25, 2014
    • Taiyo Yuden Co., Ltd.
    • Shigeo SAKURAI
    • G01 - MEASURING TESTING
  • Information Patent Application

    HIGH FREQUENCY CIRCUIT MODULE
    • Publication number 20140133117
    • Publication date May 15, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CIRCUIT SUBSTRATE
    • Publication number 20140133114
    • Publication date May 15, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT
    • Publication number 20140133120
    • Publication date May 15, 2014
    • Tatsuro SAWATARI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE
    • Publication number 20140104801
    • Publication date Apr 17, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140051367
    • Publication date Feb 20, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140051368
    • Publication date Feb 20, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140051369
    • Publication date Feb 20, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140051370
    • Publication date Feb 20, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    HIGH-FREQUENCY CIRCUIT MODULE
    • Publication number 20140051371
    • Publication date Feb 20, 2014
    • Taiyo Yuden Co., Ltd.
    • Tetsuo Saji
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20130063224
    • Publication date Mar 14, 2013
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    MULTILAYER SUBSTRATE
    • Publication number 20120300416
    • Publication date Nov 29, 2012
    • Taiyo Yuden Co., Ltd.
    • Tetsuo SAJI
    • H01 - BASIC ELECTRIC ELEMENTS