Tetsuro MIYAO

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Suwa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board, method of manufacturing the same, element housing pac...
- Patent number 9,954,160
- Issue date Apr 24, 2018
- Seiko Epson Corporation
- Hideki Ishigami
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package base, package, electronic device, electronic apparatus, and...
- Patent number 9,769,934
- Issue date Sep 19, 2017
- Seiko Epson Corporation
- Tetsuro Miyao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND...
- Publication number 20160021752
- Publication date Jan 21, 2016
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, ELECTRONIC DEVI...
- Publication number 20150223325
- Publication date Aug 6, 2015
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, ELEMENT HOUSING PAC...
- Publication number 20150130326
- Publication date May 14, 2015
- SEIKO EPSON CORPORATION
- Hideki ISHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC D...
- Publication number 20150070855
- Publication date Mar 12, 2015
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR