Tetsuro Oki

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Okayama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Dicing method
- Patent number 5,494,549
- Issue date Feb 27, 1996
- Rohm Co., Ltd.
- Tetsuro Oki
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing semiconductor elements without burrs
- Patent number 5,462,900
- Issue date Oct 31, 1995
- Rohm Co., Ltd.
- Tetsuro Oki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dicing method which uses variable sawing speeds
- Patent number 5,451,549
- Issue date Sep 19, 1995
- Rohm Co., Ltd.
- Tetsuro Oki
- B28 - WORKING CEMENT, CLAY, OR STONE