Tetsuro Toya

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of adhering wafer and wafer adhering device
- Patent number 6,692,221
- Issue date Feb 17, 2004
- Fujikoshi Machinery Corp.
- Tetsuro Toya
- F27 - FURNACES KILNS OVENS RETORTS

Patents Applicationslast 30 patents

Information Patent Application
Method of adhering wafer and wafer adhering device
- Publication number 20020090589
- Publication date Jul 11, 2002
- Fujikoshi Machinery Corp.
- Tetsuro Toya
- C30 - CRYSTAL GROWTH