Tetsuro Washida

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging substrate
- Patent number 6,239,981
- Issue date May 29, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuro Washida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,144,091
- Issue date Nov 7, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuro Washida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module with obstacle removing terminal structure
- Patent number 6,115,260
- Issue date Sep 5, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Takao Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module mounted with semiconductor device
- Patent number 5,949,135
- Issue date Sep 7, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuro Washida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a package having a plurality of bump elec...
- Patent number 5,889,327
- Issue date Mar 30, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuro Washida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card
- Patent number 5,886,874
- Issue date Mar 23, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Shigeo Onoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal configuration in semiconductor IC device
- Patent number 5,877,548
- Issue date Mar 2, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuro Washida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bendable circuit board having improved resistance to bending strain...
- Patent number 5,777,275
- Issue date Jul 7, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshitaka Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC card and method of making the same
- Patent number 5,774,339
- Issue date Jun 30, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Jun Ohbuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC card
- Patent number 5,719,746
- Issue date Feb 17, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Jun Ohbuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC card with a discharge pattern and a ground pattern separated fro...
- Patent number 5,671,123
- Issue date Sep 23, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Makoto Omori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-contact IC card communicating at multiple frequencies
- Patent number 5,585,617
- Issue date Dec 17, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Jun Ohbuchi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module having multiple circuit boards
- Patent number 5,583,748
- Issue date Dec 10, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Hidenobu Gochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC card including a substrate having improved strength and heat rad...
- Patent number 5,521,433
- Issue date May 28, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Teru Hirata
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module and IC package used for the semiconductor module
- Patent number 5,521,786
- Issue date May 28, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Hidenobu Gochi
- H01 - BASIC ELECTRIC ELEMENTS

Tetsuro Washida

Person

Patents Grantslast 30 patents

Packaging substrate

Semiconductor device

Memory module with obstacle removing terminal structure

Module mounted with semiconductor device

Semiconductor device with a package having a plurality of bump elec...

IC card

Terminal configuration in semiconductor IC device

Bendable circuit board having improved resistance to bending strain...

IC card and method of making the same

IC card

IC card with a discharge pattern and a ground pattern separated fro...

Non-contact IC card communicating at multiple frequencies

Semiconductor module having multiple circuit boards

IC card including a substrate having improved strength and heat rad...

Semiconductor module and IC package used for the semiconductor module