Tetsutsugu Hamano

Person

Shizuoka-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoelectric conversion module package
- Patent number 10,665,768
- Issue date May 26, 2020
- Yamaha Corporation
- Tetsutsugu Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,518,205
- Issue date Apr 14, 2009
- Yamaha Corporation
- Katsunori Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical component using optical transmission element joining metal...
- Patent number 7,313,292
- Issue date Dec 25, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Hashimoto
- G02 - OPTICS
Information Patent Grant
Manufacture of probe unit having lead probes extending beyond edge...
- Patent number 7,087,501
- Issue date Aug 8, 2006
- Yamaichi Electronics, Co., Ltd.
- Atsuo Hattori
- G01 - MEASURING TESTING
Information Patent Grant
Manufacture of probe unit having lead probes extending beyond edge...
- Patent number 6,946,375
- Issue date Sep 20, 2005
- Yamaha Corporation
- Atsuo Hattori
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
THERMOELECTRIC CONVERSION MODULE
- Publication number 20220149260
- Publication date May 12, 2022
- Yamaha Corporation
- Tetsutsugu HAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC CONVERSION MODULE PACKAGE
- Publication number 20190081226
- Publication date Mar 14, 2019
- Yamaha Corporation
- Tetsutsugu HAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100108117
- Publication date May 6, 2010
- Yamaha Corporation
- TETSUTSUGU HAMANO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacture of probe unit having lead probes extending beyond edge...
- Publication number 20050266690
- Publication date Dec 1, 2005
- Yamaha Corporation
- Atsuo Hattori
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20050214979
- Publication date Sep 29, 2005
- Yamaha Corporation
- Katsunori Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical component using optical transmission element joining metal...
- Publication number 20050099703
- Publication date May 12, 2005
- Yoshihiro Hashimoto
- G02 - OPTICS
Information Patent Application
Manufacture of probe unit having lead probes extending beyong edge...
- Publication number 20020137316
- Publication date Sep 26, 2002
- Atsuo Hattori
- G01 - MEASURING TESTING

Tetsutsugu Hamano

Person

Patents Grantslast 30 patents

Thermoelectric conversion module package

Semiconductor package and method for manufacturing the same

Optical component using optical transmission element joining metal...

Manufacture of probe unit having lead probes extending beyond edge...

Manufacture of probe unit having lead probes extending beyond edge...

Patents Applicationslast 30 patents

THERMOELECTRIC CONVERSION MODULE

THERMOELECTRIC CONVERSION MODULE PACKAGE

THERMOELECTRIC MODULE PACKAGE AND MANUFACTURING METHOD THEREFOR

Manufacture of probe unit having lead probes extending beyond edge...

Semiconductor package and method for manufacturing the same

Optical component using optical transmission element joining metal...

Manufacture of probe unit having lead probes extending beyong edge...