Tetsuya Hirose

Follow

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold for resin-sealing of semiconductor devices
- Patent number 6,530,764
- Issue date Mar 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor pressure sensor for use at high temperature and press...
- Patent number 5,333,505
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor pressure sensor
- Patent number 5,207,102
- Issue date May 4, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Mold for resin-sealing of semiconductor devices
- Publication number 20020012716
- Publication date Jan 31, 2002
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL