Tetsuya Koyama

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 10,134,680
- Issue date Nov 20, 2018
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part embedded substrate and method of producing an elect...
- Patent number 9,768,122
- Issue date Sep 19, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 9,451,702
- Issue date Sep 20, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,257,386
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component incorporated substrate and method for manufact...
- Patent number 9,137,900
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component built-in substrate
- Patent number 9,059,088
- Issue date Jun 16, 2015
- Shinko Electric Industries Co., Ltd.
- Nobuyuki Kurashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 8,793,868
- Issue date Aug 5, 2014
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,736,053
- Issue date May 27, 2014
- Shinko Electric Industries Co., Ltd.
- Koichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 8,096,049
- Issue date Jan 17, 2012
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded substrate and method of producing the same
- Patent number 7,989,707
- Issue date Aug 2, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming wiring on insulating resin layer
- Patent number 7,955,454
- Issue date Jun 7, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 7,882,627
- Issue date Feb 8, 2011
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,884,484
- Issue date Feb 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 7,847,384
- Issue date Dec 7, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a conductive post and wiring pattern
- Patent number 7,772,689
- Issue date Aug 10, 2010
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip-embedded substrate and method of manufacturing same
- Patent number 7,501,696
- Issue date Mar 10, 2009
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20170365559
- Publication date Dec 21, 2017
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
- Publication number 20160358858
- Publication date Dec 8, 2016
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160143139
- Publication date May 19, 2016
- Shinko Electric Industries Co., Ltd.
- Haruo Sorimachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20150179560
- Publication date Jun 25, 2015
- Shinko Electric Industries Co., LTD.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20140313681
- Publication date Oct 23, 2014
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20140063768
- Publication date Mar 6, 2014
- Shinko Electric Industries Co., LTD.
- Koichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...
- Publication number 20140054773
- Publication date Feb 27, 2014
- Nobuyuki KURASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120319274
- Publication date Dec 20, 2012
- Shinko Electric Industries Co., Ltd.
- Koichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20110256662
- Publication date Oct 20, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a multilayer wiring board
- Publication number 20110099806
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090008765
- Publication date Jan 8, 2009
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a multilayer wiring board
- Publication number 20080168652
- Publication date Jul 17, 2008
- Shinko Electric Industries Co., Ltd.
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming wiring on insulating resin layer
- Publication number 20070051459
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20070052071
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20070052083
- Publication date Mar 8, 2007
- Shinko Electric Industries Co., Ltd.
- Tsuyoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20060208356
- Publication date Sep 21, 2006
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor chip-embedded substrate and method of manufacturing same
- Publication number 20060022332
- Publication date Feb 2, 2006
- Tetsuya Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tetsuya Koyama

Person

Patents Grantslast 30 patents

Electronic part embedded substrate and method of producing an elect...

Electronic part embedded substrate and method of producing an elect...

Chip embedded substrate and method of producing the same

Wiring substrate and semiconductor device

Electronic component incorporated substrate and method for manufact...

Electronic component built-in substrate

Chip embedded substrate and method of producing the same

Semiconductor device

Method of manufacturing a multilayer wiring board

Chip embedded substrate and method of producing the same

Method for forming wiring on insulating resin layer

Method of manufacturing a multilayer wiring board

Wiring board and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor package with a conductive post and wiring pattern

Semiconductor chip-embedded substrate and method of manufacturing same

Patents Applicationslast 30 patents

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...

ELECTRONIC COMPONENT DEVICE AND METHOD FOR MANUFACTURING THE SAME

Wiring Substrate and Semiconductor Device

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACT...

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

Method of manufacturing a multilayer wiring board

CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME

Method of manufacturing a multilayer wiring board

Method for forming wiring on insulating resin layer

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Wiring board and method of manufacturing the same

Semiconductor chip-embedded substrate and method of manufacturing same