Tetsuya MAKI

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate positioning apparatus, substrate positioning method, and...
- Patent number 11,545,383
- Issue date Jan 3, 2023
- Tokyo Electron Limited
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating apparatus
- Patent number 9,401,291
- Issue date Jul 26, 2016
- Tokyo Electron Limited
- Yuji Mimura
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240335913
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BON...
- Publication number 20240300113
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240304475
- Publication date Sep 12, 2024
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240006207
- Publication date Jan 4, 2024
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20230326797
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20230275062
- Publication date Aug 31, 2023
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220375799
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POSITIONING APPARATUS, SUBSTRATE POSITIONING METHOD, AND...
- Publication number 20210249293
- Publication date Aug 12, 2021
- TOKYO ELECTRON LIMITED
- Tetsuya Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING APPARATUS
- Publication number 20150128858
- Publication date May 14, 2015
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
COATING APPARATUS AND METHOD OF CLEANING SEALING UNIT
- Publication number 20140352611
- Publication date Dec 4, 2014
- TOKYO ELECTRON LIMITED
- Tetsuya MAKI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Tetsuya MAKI

Person

Patents Grantslast 30 patents

Substrate positioning apparatus, substrate positioning method, and...

Coating apparatus

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD

SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BON...

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

BONDING APPARATUS AND BONDING METHOD

SUBSTRATE POSITIONING APPARATUS, SUBSTRATE POSITIONING METHOD, AND...

COATING APPARATUS

COATING APPARATUS AND METHOD OF CLEANING SEALING UNIT