Tetsuya MIEDA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power cable, and method for manufacturing power cable
- Patent number 12,068,088
- Issue date Aug 20, 2024
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating resin composition and production method therefor, insula...
- Patent number 11,990,253
- Issue date May 21, 2024
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating tape for coating connection portion of power cable, meth...
- Patent number 11,823,816
- Issue date Nov 21, 2023
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for sealing organic electronic device element, re...
- Patent number 11,139,449
- Issue date Oct 5, 2021
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, and method of bonding an adherend and method...
- Patent number 10,988,646
- Issue date Apr 27, 2021
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable and hygroscopic resin composition for sealing electronic de...
- Patent number 10,829,670
- Issue date Nov 10, 2020
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable and hygroscopic resin composition for sealing electronic de...
- Patent number 10,829,669
- Issue date Nov 10, 2020
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable and hygroscopic resin composition for sealing electronic de...
- Patent number 10,556,974
- Issue date Feb 11, 2020
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Resin composition for sealing electronic device, and electronic device
- Patent number 10,196,534
- Issue date Feb 5, 2019
- Furukawa Electric Co., Ltd.
- Takumi Asanuma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent resin composition for organic electroluminescent elemen...
- Patent number 10,115,904
- Issue date Oct 30, 2018
- Furukawa Electric Co., Ltd.
- Kunihiko Ishiguro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 10,084,153
- Issue date Sep 25, 2018
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition for sealing electronic devices, and electronic de...
- Patent number 10,079,360
- Issue date Sep 18, 2018
- Furukawa Electric Co., Ltd.
- Tetsuya Mieda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition for element encapsulation for organic electronic...
- Patent number 10,043,996
- Issue date Aug 7, 2018
- Furukawa Electric Co., Ltd.
- Masami Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for sealing organic electroluminescent element, s...
- Patent number 9,913,324
- Issue date Mar 6, 2018
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler material for organic electroluminescent element and method o...
- Patent number 9,793,511
- Issue date Oct 17, 2017
- Furukawa Electric Co., Ltd.
- Naoaki Mihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent resin composition for sealing organic electroluminescen...
- Patent number 9,758,690
- Issue date Sep 12, 2017
- Furukawa Electric Co., Ltd.
- Kunihiko Ishiguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for sealing organic electroluminescent device; me...
- Patent number 9,257,671
- Issue date Feb 9, 2016
- Furukawa Electric Co., Ltd.
- Toshihiro Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSULATING RESIN COMPOSITION FOR ELECTRIC POWER CABLE, ELECTRIC POW...
- Publication number 20250034381
- Publication date Jan 30, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Shingo MITSUGI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POWER CABLE, AND METHOD FOR MANUFACTURING POWER CABLE
- Publication number 20230017246
- Publication date Jan 19, 2023
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, INSULA...
- Publication number 20220157488
- Publication date May 19, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INSULATING TAPE FOR COATING CONNECTION PORTION OF POWER CABLE, METH...
- Publication number 20220157486
- Publication date May 19, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, AND METHOD OF BONDING AN ADHEREND AND METHOD...
- Publication number 20180291242
- Publication date Oct 11, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...
- Publication number 20180208804
- Publication date Jul 26, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...
- Publication number 20180208805
- Publication date Jul 26, 2018
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICES, AND ELECTRONIC DE...
- Publication number 20170331070
- Publication date Nov 16, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...
- Publication number 20170327608
- Publication date Nov 16, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C07 - ORGANIC CHEMISTRY
Information Patent Application
RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONIC DEVICE ELEMENT, RE...
- Publication number 20170047548
- Publication date Feb 16, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
- Publication number 20160362576
- Publication date Dec 15, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Takumi ASANUMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308164
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...
- Publication number 20160308165
- Publication date Oct 20, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT SEALING RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, EL...
- Publication number 20160017197
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Tetsuya MIEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...
- Publication number 20160020423
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Keiji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...
- Publication number 20160020426
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Masami AOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALANT COMPOSITION AND SEALING SHEET OBTAINED FROM THE COMPOSITION
- Publication number 20160017186
- Publication date Jan 21, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Masami Aoyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRANSPARENT RESIN COMPOSITION FOR ORGANIC ELECTROLUMINESCENT ELEMEN...
- Publication number 20160005973
- Publication date Jan 7, 2016
- FURUKAWA ELECTRIC CO., LTD.
- Kunihiko ISHIGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCEN...
- Publication number 20150291824
- Publication date Oct 15, 2015
- FURUKAWA ELECTRIC CO., LTD.
- Kunihiko ISHIGURO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT, S...
- Publication number 20150091436
- Publication date Apr 2, 2015
- FURUKAWA ELECTRIC CO., LTD.
- Naoaki MIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT DEVICE; ME...
- Publication number 20140291655
- Publication date Oct 2, 2014
- Toshihiro SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS

Tetsuya MIEDA

Person

Patents Grantslast 30 patents

Power cable, and method for manufacturing power cable

Insulating resin composition and production method therefor, insula...

Insulating tape for coating connection portion of power cable, meth...

Resin composition for sealing organic electronic device element, re...

Adhesive composition, and method of bonding an adherend and method...

Curable and hygroscopic resin composition for sealing electronic de...

Curable and hygroscopic resin composition for sealing electronic de...

Curable and hygroscopic resin composition for sealing electronic de...

Resin composition for sealing electronic device, and electronic device

Transparent resin composition for organic electroluminescent elemen...

Filler material for organic electroluminescent element and method o...

Resin composition for sealing electronic devices, and electronic de...

Resin composition for element encapsulation for organic electronic...

Resin composition for sealing organic electroluminescent element, s...

Filler material for organic electroluminescent element and method o...

Transparent resin composition for sealing organic electroluminescen...

Resin composition for sealing organic electroluminescent device; me...

Patents Applicationslast 30 patents

INSULATING RESIN COMPOSITION FOR ELECTRIC POWER CABLE, ELECTRIC POW...

POWER CABLE, AND METHOD FOR MANUFACTURING POWER CABLE

INSULATING RESIN COMPOSITION AND PRODUCTION METHOD THEREFOR, INSULA...

INSULATING TAPE FOR COATING CONNECTION PORTION OF POWER CABLE, METH...

ADHESIVE COMPOSITION, AND METHOD OF BONDING AN ADHEREND AND METHOD...

CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...

CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...

RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICES, AND ELECTRONIC DE...

CURABLE AND HYGROSCOPIC RESIN COMPOSITION FOR SEALING ELECTRONIC DE...

RESIN COMPOSITION FOR SEALING ORGANIC ELECTRONIC DEVICE ELEMENT, RE...

RESIN COMPOSITION FOR SEALING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...

FILLER MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND METHOD O...

ELEMENT SEALING RESIN COMPOSITION FOR ORGANIC ELECTRONIC DEVICE, EL...

RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...

RESIN COMPOSITION FOR ELEMENT ENCAPSULATION FOR ORGANIC ELECTRONIC...

SEALANT COMPOSITION AND SEALING SHEET OBTAINED FROM THE COMPOSITION

TRANSPARENT RESIN COMPOSITION FOR ORGANIC ELECTROLUMINESCENT ELEMEN...

TRANSPARENT RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCEN...

RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT ELEMENT, S...

RESIN COMPOSITION FOR SEALING ORGANIC ELECTROLUMINESCENT DEVICE; ME...