Tetsuya Otsuki

Person

Nagano-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Vibrator device, oscillator, gyro sensor, electronic apparatus, and...
- Patent number 12,034,433
- Issue date Jul 9, 2024
- Seiko Epson Corporation
- Tetsuya Otsuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
- Patent number 11,776,860
- Issue date Oct 3, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device
- Patent number 11,688,727
- Issue date Jun 27, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,659,664
- Issue date May 23, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibrator device, oscillator, gyro sensor, electronic apparatus, and...
- Patent number 11,509,288
- Issue date Nov 22, 2022
- Seiko Epson Corporation
- Tetsuya Otsuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic device
- Patent number 11,376,770
- Issue date Jul 5, 2022
- Seiko Epson Corporation
- Masataka Kazuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sensor unit, method of manufacturing sensor unit, inertial measurem...
- Patent number 11,262,374
- Issue date Mar 1, 2022
- Seiko Epson Corporation
- Tetsuya Otsuki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Physical quantity sensor, electronic apparatus, and vehicle
- Patent number 10,866,260
- Issue date Dec 15, 2020
- Seiko Epson Corporation
- Tetsuya Otsuki
- G01 - MEASURING TESTING
Information Patent Grant
Oscillator, electronic apparatus, and vehicle
- Patent number 10,742,169
- Issue date Aug 11, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrator device, oscillator, gyro sensor, electronic apparatus, and...
- Patent number 10,651,819
- Issue date May 12, 2020
- Seiko Epson Corporation
- Tetsuya Otsuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vibrator device, oscillator, electronic device, and vehicle
- Patent number 10,615,747
- Issue date Apr 7, 2020
- Seiko Epson Corporation
- Hisahiro Ito
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic device, method for producing electronic device, electron...
- Patent number 10,340,440
- Issue date Jul 2, 2019
- Seiko Epson Corporation
- Tetsuya Otsuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board, method of manufacturing the same, element housing pac...
- Patent number 9,954,160
- Issue date Apr 24, 2018
- Seiko Epson Corporation
- Hideki Ishigami
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package base, package, electronic device, electronic apparatus, and...
- Patent number 9,769,934
- Issue date Sep 19, 2017
- Seiko Epson Corporation
- Tetsuro Miyao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 9,474,180
- Issue date Oct 18, 2016
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibrating device, method for manufacturing vibrating device, and el...
- Patent number 9,088,262
- Issue date Jul 21, 2015
- Seiko Epson Corporation
- Tetsuya Otsuki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Oscillation device and method for manufacturing oscillation device
- Patent number 9,065,417
- Issue date Jun 23, 2015
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device and electronic device
- Patent number 8,537,567
- Issue date Sep 17, 2013
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 7,696,082
- Issue date Apr 13, 2010
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate, semiconductor device, methods of manufactur...
- Patent number 7,541,278
- Issue date Jun 2, 2009
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate, semiconductor device, methods of manufactur...
- Patent number 7,413,975
- Issue date Aug 19, 2008
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 7,372,167
- Issue date May 13, 2008
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method of manufacturing the same, semiconductor devic...
- Patent number 7,189,598
- Issue date Mar 13, 2007
- Seiko Epson Corporation
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sealing type semiconductor device that includes a plurality o...
- Patent number 6,133,623
- Issue date Oct 17, 2000
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multiple heat sink resin sealing type semiconduc...
- Patent number 5,891,759
- Issue date Apr 6, 1999
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of making the same
- Patent number 5,801,435
- Issue date Sep 1, 1998
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device having thin portions formed...
- Patent number 5,777,380
- Issue date Jul 7, 1998
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device
- Patent number 5,719,442
- Issue date Feb 17, 1998
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a semiconductor device with a heat sink
- Patent number 5,653,891
- Issue date Aug 5, 1997
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of making the same
- Patent number 5,633,529
- Issue date May 27, 1997
- Seiko Epson Corporation
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...
- Publication number 20230040197
- Publication date Feb 9, 2023
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20220084898
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220087023
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220085004
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20200254663
- Publication date Aug 13, 2020
- SEIKO EPSON CORPORATION
- Masataka KAZUNO
- G01 - MEASURING TESTING
Information Patent Application
Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...
- Publication number 20200235717
- Publication date Jul 23, 2020
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Unit, Method Of Manufacturing Sensor Unit, Inertial Measurem...
- Publication number 20190162745
- Publication date May 30, 2019
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- B60 - VEHICLES IN GENERAL
Information Patent Application
OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE
- Publication number 20190165732
- Publication date May 30, 2019
- SEIKO EPSON CORPORATION
- Hisahiro ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATOR DEVICE, OSCILLATOR, GYRO SENSOR, ELECTRONIC APPARATUS, AND...
- Publication number 20180278235
- Publication date Sep 27, 2018
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical Quantity Sensor, Electronic Apparatus, And Vehicle
- Publication number 20180275160
- Publication date Sep 27, 2018
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- G01 - MEASURING TESTING
Information Patent Application
VIBRATOR DEVICE, OSCILLATOR, ELECTRONIC DEVICE, AND VEHICLE
- Publication number 20180269834
- Publication date Sep 20, 2018
- SEIKO EPSON CORPORATION
- Hisahiro ITO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRON...
- Publication number 20160293827
- Publication date Oct 6, 2016
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND...
- Publication number 20160021752
- Publication date Jan 21, 2016
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, ELECTRONIC DEVI...
- Publication number 20150223325
- Publication date Aug 6, 2015
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD OF MANUFACTURING THE SAME, ELEMENT HOUSING PAC...
- Publication number 20150130326
- Publication date May 14, 2015
- SEIKO EPSON CORPORATION
- Hideki ISHIGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC D...
- Publication number 20150070855
- Publication date Mar 12, 2015
- SEIKO EPSON CORPORATION
- Tetsuro MIYAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20130322046
- Publication date Dec 5, 2013
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OSCILLATION DEVICE AND METHOD FOR MANUFACTURING OSCILLATION DEVICE
- Publication number 20130049542
- Publication date Feb 28, 2013
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120318059
- Publication date Dec 20, 2012
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- G01 - MEASURING TESTING
Information Patent Application
VIBRATING DEVICE, METHOD FOR MANUFACTURING VIBRATING DEVICE, AND EL...
- Publication number 20120223622
- Publication date Sep 6, 2012
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SENSOR DEVICE, METHOD OF MANUFACTURING SENSOR DEVICE, MOTION SENSOR...
- Publication number 20110210408
- Publication date Sep 1, 2011
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20100302756
- Publication date Dec 2, 2010
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20100102423
- Publication date Apr 29, 2010
- SEIKO EPSON CORPORATION
- Tetsuya OTSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect substrate, semiconductor device, methods of manufactur...
- Publication number 20080293239
- Publication date Nov 27, 2008
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20080174012
- Publication date Jul 24, 2008
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board, method of manufacturing the same, semiconductor devic...
- Publication number 20070094870
- Publication date May 3, 2007
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT SUBSTRATE, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTUR...
- Publication number 20060165875
- Publication date Jul 27, 2006
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060049510
- Publication date Mar 9, 2006
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for manufacturing semiconductor device
- Publication number 20060049519
- Publication date Mar 9, 2006
- SEIKO EPSON CORPORATION
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, method of manufacturing the same, semiconductor devic...
- Publication number 20040237296
- Publication date Dec 2, 2004
- Tetsuya Otsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tetsuya Otsuki

Person

Patents Grantslast 30 patents

Vibrator device, oscillator, gyro sensor, electronic apparatus, and...

Method of manufacturing electronic devices with a cap and molding

Electronic device

Electronic device

Vibrator device, oscillator, gyro sensor, electronic apparatus, and...

Method of manufacturing electronic device

Sensor unit, method of manufacturing sensor unit, inertial measurem...

Physical quantity sensor, electronic apparatus, and vehicle

Oscillator, electronic apparatus, and vehicle

Vibrator device, oscillator, gyro sensor, electronic apparatus, and...

Vibrator device, oscillator, electronic device, and vehicle

Electronic device, method for producing electronic device, electron...

Wiring board, method of manufacturing the same, element housing pac...

Package base, package, electronic device, electronic apparatus, and...

Method of manufacturing electronic device and electronic device

Vibrating device, method for manufacturing vibrating device, and el...

Oscillation device and method for manufacturing oscillation device

Method of manufacturing electronic device and electronic device

Semiconductor device manufacturing method, semiconductor device, an...

Interconnect substrate, semiconductor device, methods of manufactur...

Interconnect substrate, semiconductor device, methods of manufactur...

Semiconductor device and method of manufacturing semiconductor device

Wiring board, method of manufacturing the same, semiconductor devic...

Resin sealing type semiconductor device that includes a plurality o...

Method of making a multiple heat sink resin sealing type semiconduc...

Resin sealing type semiconductor device and method of making the same

Resin sealing type semiconductor device having thin portions formed...

Resin sealing type semiconductor device

Method of producing a semiconductor device with a heat sink

Resin sealing type semiconductor device and method of making the same

Patents Applicationslast 30 patents

Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...

METHOD OF MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

METHOD OF MANUFACTURING ELECTRONIC DEVICE

Vibrator Device, Oscillator, Gyro Sensor, Electronic Apparatus, And...

Sensor Unit, Method Of Manufacturing Sensor Unit, Inertial Measurem...

OSCILLATOR, ELECTRONIC APPARATUS, AND VEHICLE

VIBRATOR DEVICE, OSCILLATOR, GYRO SENSOR, ELECTRONIC APPARATUS, AND...

Physical Quantity Sensor, Electronic Apparatus, And Vehicle

VIBRATOR DEVICE, OSCILLATOR, ELECTRONIC DEVICE, AND VEHICLE

ELECTRONIC DEVICE, METHOD FOR PRODUCING ELECTRONIC DEVICE, ELECTRON...

PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND...

WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, ELECTRONIC DEVI...

WIRING BOARD, METHOD OF MANUFACTURING THE SAME, ELEMENT HOUSING PAC...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, ELECTRONIC D...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

OSCILLATION DEVICE AND METHOD FOR MANUFACTURING OSCILLATION DEVICE

SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

VIBRATING DEVICE, METHOD FOR MANUFACTURING VIBRATING DEVICE, AND EL...

SENSOR DEVICE, METHOD OF MANUFACTURING SENSOR DEVICE, MOTION SENSOR...

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

Interconnect substrate, semiconductor device, methods of manufactur...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...

Wiring board, method of manufacturing the same, semiconductor devic...

INTERCONNECT SUBSTRATE, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTUR...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Wiring board, method of manufacturing the same, semiconductor devic...