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Tetsuya Tao
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Process for making a semiconductor device having a roughened surface
Patent number
7,560,372
Issue date
Jul 14, 2009
NEC Electronics Corporation
Hiroaki Tomimori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a roughened surface
Patent number
7,170,172
Issue date
Jan 30, 2007
NEC Electronics Corporation
Hiroaki Tomimori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
6,756,685
Issue date
Jun 29, 2004
NEC Electronics Corporation
Tetsuya Tao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming solder bumps on a semiconductor device using bump...
Patent number
6,432,807
Issue date
Aug 13, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vented semiconductor device package having separate substrate, stre...
Patent number
6,410,981
Issue date
Jun 25, 2002
NEC Corporation
Tetsuya Tao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Process or making a semiconductor device having a roughened surface
Publication number
20070015351
Publication date
Jan 18, 2007
NEC ELECTRONICS CORPORATION
Hiroaki Tomimori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method for producing the same
Publication number
20030111731
Publication date
Jun 19, 2003
NEC ELECTRONICS CORPORATION
Hiroaki Tomimori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device
Publication number
20030030134
Publication date
Feb 13, 2003
NEC Corporation
Tetsuya Tao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020177295
Publication date
Nov 28, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020173135
Publication date
Nov 21, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump transfer plate, manufacturing method thereof, semiconductor de...
Publication number
20020173136
Publication date
Nov 21, 2002
NEC Corporation
Hiroyuki Tsukui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING SEPARATE SUBSTRATE, STRENGTHENI...
Publication number
20010013640
Publication date
Aug 16, 2001
TETSUYA TAO
H01 - BASIC ELECTRIC ELEMENTS