Tetsuya Tokunaga

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bump bonding method apparatus
- Patent number 6,902,101
- Issue date Jun 7, 2005
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and apparatus
- Patent number 6,712,111
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare chip mounting method and bare chip mounting system
- Patent number 6,680,221
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 6,474,538
- Issue date Nov 5, 2002
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bump bonding method and apparatue
- Publication number 20030094481
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Satoshi Horie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bare chip mounting method and bare chip mounting system
- Publication number 20030096451
- Publication date May 22, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and apparatus
- Publication number 20020125303
- Publication date Sep 12, 2002
- Matsushita Electric Industrial Co., Ltd.
- Tetsuya Tokunaga
- H01 - BASIC ELECTRIC ELEMENTS