Tetsuya UEDA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Nonreciprocal circuit element and method of manufacturing the same
- Patent number 11,062,832
- Issue date Jul 13, 2021
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate inspecting method and inspecting apparatus
- Patent number 10,996,257
- Issue date May 4, 2021
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Non-reciprocal circuit element and method for manufacturing the same
- Patent number 10,944,143
- Issue date Mar 9, 2021
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 10,490,422
- Issue date Nov 26, 2019
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip mounter, electronic circuit substrate, and power module
- Patent number 10,194,519
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,074,598
- Issue date Sep 11, 2018
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat radiation structure for semiconductor device
- Patent number 9,293,390
- Issue date Mar 22, 2016
- Mitsubishi Electric Corporation
- Hiroki Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,029,994
- Issue date May 12, 2015
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 8,502,385
- Issue date Aug 6, 2013
- Mitsubishi Electric Corporation
- Seiji Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device and manufacturing method therefor
- Patent number 7,772,709
- Issue date Aug 10, 2010
- Mitsubishi Electric Corporation
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,071,755
- Issue date Jun 6, 2000
- Mitsubushi Denki Kabushiki Kaisha
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrateless resin encapsulated semiconductor device
- Patent number 5,969,426
- Issue date Oct 19, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Shinji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,701,033
- Issue date Dec 23, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and module
- Patent number 5,592,019
- Issue date Jan 7, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,508,232
- Issue date Apr 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor device having a hanging heat spreading p...
- Patent number 5,334,872
- Issue date Aug 2, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having particular power distribution interconn...
- Patent number 5,309,021
- Issue date May 3, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Haruo Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape
- Patent number 5,196,917
- Issue date Mar 23, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 5,166,099
- Issue date Nov 24, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding packaged semiconductor device incorporating...
- Patent number 5,157,478
- Issue date Oct 20, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape and method of manufacturing semiconductor device emplo...
- Patent number 5,126,824
- Issue date Jun 30, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having particular lead structure for m...
- Patent number 5,105,261
- Issue date Apr 14, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,083,191
- Issue date Jan 21, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated semiconductor device with heat radiator
- Patent number 5,073,817
- Issue date Dec 17, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape including molten resin flow path element for resin pac...
- Patent number 5,064,706
- Issue date Nov 12, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor card
- Patent number 5,031,026
- Issue date Jul 9, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular semiconductor device
- Patent number 5,025,307
- Issue date Jun 18, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor card which can be folded
- Patent number 5,004,899
- Issue date Apr 2, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 4,949,158
- Issue date Aug 14, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector in external device for connection to IC card
- Patent number 4,926,034
- Issue date May 15, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
- Publication number 20250016919
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Motoki MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Nonreciprocal Circuit Element and Method of Manufacturing the Same
- Publication number 20210142935
- Publication date May 13, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE INSPECTING METHOD AND INSPECTING APPARATUS
- Publication number 20190361067
- Publication date Nov 28, 2019
- Mitsubishi Electric Corporation
- Tetsuya UEDA
- G01 - MEASURING TESTING
Information Patent Application
IRREVERSIBLE CIRCUIT ELEMENT, IRREVERSIBLE CIRCUIT DEVICE, AND METH...
- Publication number 20190139702
- Publication date May 9, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yoichi KITAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Reciprocal Circuit Element and Method for Manufacturing the Same
- Publication number 20190123413
- Publication date Apr 25, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Tetsuya Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE
- Publication number 20190037680
- Publication date Jan 31, 2019
- Mitsubishi Electric Corporation
- Tetsuya UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20180174864
- Publication date Jun 21, 2018
- Mitsubishi Electric Corporation
- Tetsuya UEDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170345742
- Publication date Nov 30, 2017
- Mitsubishi Electric Corporation
- Ken SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150255370
- Publication date Sep 10, 2015
- Mitsubishi Electric Corporation
- Hiroki Shiota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120313252
- Publication date Dec 13, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Tetsuya UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20120098138
- Publication date Apr 26, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Seiji OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090302444
- Publication date Dec 10, 2009
- MITSUBISHI ELECTRIC CORPORATION
- Tetsuya UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Differential amplifier with temperature compensating function
- Publication number 20040251965
- Publication date Dec 16, 2004
- Tetsuya Ueda
- H03 - BASIC ELECTRONIC CIRCUITRY

Tetsuya UEDA

Person

Patents Grantslast 30 patents

Nonreciprocal circuit element and method of manufacturing the same

Insulating substrate inspecting method and inspecting apparatus

Non-reciprocal circuit element and method for manufacturing the same

Manufacturing method for semiconductor device

Chip mounter, electronic circuit substrate, and power module

Semiconductor device and manufacturing method thereof

Heat radiation structure for semiconductor device

Semiconductor device

Power semiconductor device

Resin sealed semiconductor device and manufacturing method therefor

Method of manufacturing semiconductor device

Substrateless resin encapsulated semiconductor device

Semiconductor device

Semiconductor device and module

Method of manufacturing a semiconductor device

Encapsulated semiconductor device having a hanging heat spreading p...

Semiconductor device having particular power distribution interconn...

Carrier tape

Manufacturing method for semiconductor device

Tape automated bonding packaged semiconductor device incorporating...

Carrier tape and method of manufacturing semiconductor device emplo...

Semiconductor device package having particular lead structure for m...

Semiconductor device

Resin encapsulated semiconductor device with heat radiator

Carrier tape including molten resin flow path element for resin pac...

Thin semiconductor card

Modular semiconductor device

Semiconductor card which can be folded

Semiconductor device

Connector in external device for connection to IC card

Patents Applicationslast 30 patents

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...

Nonreciprocal Circuit Element and Method of Manufacturing the Same

INSULATING SUBSTRATE INSPECTING METHOD AND INSPECTING APPARATUS

IRREVERSIBLE CIRCUIT ELEMENT, IRREVERSIBLE CIRCUIT DEVICE, AND METH...

Non-Reciprocal Circuit Element and Method for Manufacturing the Same

CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

RESIN SEALED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Differential amplifier with temperature compensating function