Tetsuya Utano

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure with movement mechanism
- Patent number 11,509,126
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding apparatus
- Patent number 11,410,960
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for linearly moving movable body relative to o...
- Patent number 11,410,866
- Issue date Aug 9, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Plasma apparatus and method for producing the same
- Patent number 10,573,525
- Issue date Feb 25, 2020
- Shinkawa Ltd.
- Tetsuya Utano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plasma ignition system, plasma ignition method, and plasma generati...
- Patent number 8,716,939
- Issue date May 6, 2014
- Shinkawa Ltd.
- Tetsuya Utano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING APPARATUS
- Publication number 20220320034
- Publication date Oct 6, 2022
- SHINKAWA LTD.
- Hijiri HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20220216078
- Publication date Jul 7, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220130796
- Publication date Apr 28, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20210175201
- Publication date Jun 10, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT
- Publication number 20200411352
- Publication date Dec 31, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE
- Publication number 20200339375
- Publication date Oct 29, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING DEVICE
- Publication number 20200286850
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...
- Publication number 20200279762
- Publication date Sep 3, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...
- Publication number 20200251369
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Tetsuya UTANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20160351536
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Toru Maeda
- B08 - CLEANING
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20140034712
- Publication date Feb 6, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20130240146
- Publication date Sep 19, 2013
- SHINKAWA LTD.
- Tetsuya Utano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA IGNITION SYSTEM, PLASMA IGNITION METHOD, AND PLASMA GENERATI...
- Publication number 20120280618
- Publication date Nov 8, 2012
- SHINKAWA LTD.
- Tetsuya Utano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding and wire bonding method
- Publication number 20080093416
- Publication date Apr 24, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tetsuya Utano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tetsuya Utano

Person

Patents Grantslast 30 patents

Mounting apparatus

Mounting apparatus

Mounting apparatus

Wiring structure with movement mechanism

Bonding apparatus

Apparatus and method for linearly moving movable body relative to o...

Device and method for positioning first object in relation to secon...

Plasma apparatus and method for producing the same

Plasma ignition system, plasma ignition method, and plasma generati...

Bonding apparatus and wire bonding method

Patents Applicationslast 30 patents

MOUNTING APPARATUS

MOUNTING DEVICE

MOUNTING APPARATUS

MOUNTING APPARATUS

DEVICE AND METHOD FOR LINEARLY MOVING MOVABLE BODY RELATIVE TO OBJECT

WIRING STRUCTURE

BONDING DEVICE

DEVICE AND METHOD FOR LINEARLY MOVING FIRST AND SECOND MOVING BODIE...

DEVICE AND METHOD FOR POSITIONING FIRST OBJECT IN RELATION TO SECON...

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

PLASMA APPARATUS AND METHOD FOR PRODUCING THE SAME

PLASMA IGNITION SYSTEM, PLASMA IGNITION METHOD, AND PLASMA GENERATI...

BONDING APPARATUS AND WIRE BONDING METHOD

Wire bonding and wire bonding method