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Tetsuya Yamamoto
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Mine, JP
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last 30 patents
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Patent Grant
Semiconductor packaging metal lid
Patent number
6,306,526
Issue date
Oct 23, 2001
Sumitomo Metal (SMI) Electronics Devices Inc.
Tetsuya Yamamoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Lid with variable solder layer for sealing semiconductor package, p...
Patent number
5,821,455
Issue date
Oct 13, 1998
Sumitomo Metal (SMI) Electronics Devices, Inc.
Tetsuya Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lid for semiconductor package and package having the lid
Patent number
5,414,300
Issue date
May 9, 1995
Sumitomo Metal Ceramics Inc.
Yoji Tozawa
H01 - BASIC ELECTRIC ELEMENTS