Tetsuyuki Shigesada

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Kakogawa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flux and solder paste
- Patent number 10,099,321
- Issue date Oct 16, 2018
- Harima Chemicals, Inc.
- Kosuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, and electronic circuit board
- Patent number 9,445,508
- Issue date Sep 13, 2016
- HARIMA CHEMICALS, INCORPORATED
- Kensuke Nakanishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20180339371
- Publication date Nov 29, 2018
- HARIMA CHEMICALS, INC.
- Kosuke INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20150343571
- Publication date Dec 3, 2015
- HARIMA CHEMICALS, INC.
- Kosuke INOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
- Publication number 20150305167
- Publication date Oct 22, 2015
- HARIMA CHEMICALS, INCORPORATED
- Kensuke NAKANISHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FLUX FOR SOLDERING AND SOLDER PASTE COMPOSITION
- Publication number 20140053954
- Publication date Feb 27, 2014
- Harima Chemicals, Inc
- Kousuke Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR