Tetsuyuki TSUCHIDA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method of producing wiring board
- Patent number 12,342,473
- Issue date Jun 24, 2025
- TOPPAN INC.
- Takeshi Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass core, multilayer circuit board, and method of manufacturing g...
- Patent number 11,756,846
- Issue date Sep 12, 2023
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass wiring board
- Patent number 11,516,907
- Issue date Nov 29, 2022
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Core substrate, multi-layer wiring substrate, semiconductor package...
- Patent number 10,923,439
- Issue date Feb 16, 2021
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate for bonding using solder having a low melting poin...
- Patent number 9,883,586
- Issue date Jan 30, 2018
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 9,572,252
- Issue date Feb 14, 2017
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD
- Publication number 20230254983
- Publication date Aug 10, 2023
- TOPPAN INC.
- Takeshi TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS WIRING BOARD
- Publication number 20210144847
- Publication date May 13, 2021
- Toppan Printing Co.,Ltd.
- Tetsuyuki TSUCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE, MULTI-LAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE...
- Publication number 20200343199
- Publication date Oct 29, 2020
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE, MULTILAYER CIRCUIT BOARD, AND METHOD OF MANUFACTURING G...
- Publication number 20200273763
- Publication date Aug 27, 2020
- Toppan Printing Co.,Ltd.
- Tetsuyuki TSUCHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE, MULTI-LAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE...
- Publication number 20190287930
- Publication date Sep 19, 2019
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180192510
- Publication date Jul 5, 2018
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150334828
- Publication date Nov 19, 2015
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140332259
- Publication date Nov 13, 2014
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tetsuyuki TSUCHIDA

Person

Patents Grantslast 30 patents

Wiring board and method of producing wiring board

Glass core, multilayer circuit board, and method of manufacturing g...

Glass wiring board

Core substrate, multi-layer wiring substrate, semiconductor package...

Wiring substrate for bonding using solder having a low melting poin...

Wiring substrate and method of manufacturing wiring substrate

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD

WIRING BOARD AND METHOD OF PRODUCING WIRING BOARD

GLASS WIRING BOARD

CORE SUBSTRATE, MULTI-LAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE...

GLASS CORE, MULTILAYER CIRCUIT BOARD, AND METHOD OF MANUFACTURING G...

CORE SUBSTRATE, MULTI-LAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE