Thanawat JAENGKRAJARNG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming protective layer around...
- Patent number 11,804,416
- Issue date Oct 31, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bonding layer with spacers between a package substrate a...
- Patent number 11,145,575
- Issue date Oct 12, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Protective Layer Around...
- Publication number 20220077019
- Publication date Mar 10, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20220028762
- Publication date Jan 27, 2022
- UTAC Headquarters Pte. Ltd.
- Tanawan CHAOWASAKOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20200144162
- Publication date May 7, 2020
- UTAC Headquarters Pte. Ltd.
- Tanawan CHAOWASAKOO
- H01 - BASIC ELECTRIC ELEMENTS