Thang Dahn Truong

Person

Grand Prairie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,490,517
- Issue date Nov 1, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 11,439,013
- Issue date Sep 6, 2022
- ABB POWER ELECTRONICS, INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer printed circuit boards for power modules
- Patent number 10,993,325
- Issue date Apr 27, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stencil set and system for printing solder paste for printed circui...
- Patent number 10,028,392
- Issue date Jul 17, 2018
- General Electric Company
- John Andrew Trelford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning method for component boards
- Patent number 9,426,901
- Issue date Aug 23, 2016
- General Electric Company
- John Andrew Trelford
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Compliant surface mount electrical contacts for circuit boards and...
- Patent number 6,997,727
- Issue date Feb 14, 2006
- Zierick Manufacturing Corp.
- Janos Legrady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-substrate conductive mount for a circuit board, circuit board...
- Patent number 6,310,301
- Issue date Oct 30, 2001
- Randy T. Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board apparatus
- Patent number 6,301,120
- Issue date Oct 9, 2001
- Lucent Technologies Inc.
- Shiaw-Jong Steve Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder process for printed wiring boards
- Patent number 6,264,093
- Issue date Jul 24, 2001
- Raymond W. Pilukaitis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a surface mountable power supply module
- Patent number 6,189,203
- Issue date Feb 20, 2001
- Lucent Technologies Inc.
- Randy T. Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210212210
- Publication date Jul 8, 2021
- ABB Power Electronics, Inc.
- John Andrew Trelford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210037648
- Publication date Feb 4, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES
- Publication number 20210037649
- Publication date Feb 4, 2021
- ABB POWER ELECTRONICS INC.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STENCIL SET AND SYSTEM FOR PRINTING SOLDER PASTE FOR PRINTED CIRCUI...
- Publication number 20160345443
- Publication date Nov 24, 2016
- GENERAL ELECTRIC COMPANY
- John Andrew Trelford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING METHOD AND APPARATUS FOR COMPONENT BOARDS
- Publication number 20130092721
- Publication date Apr 18, 2013
- General Electric
- John Andrew Trelford
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Thang Dahn Truong

Person

Patents Grantslast 30 patents

Interposer printed circuit boards for power modules

Interposer printed circuit boards for power modules

Interposer printed circuit boards for power modules

Stencil set and system for printing solder paste for printed circui...

Patterning method for component boards

Compliant surface mount electrical contacts for circuit boards and...

Inter-substrate conductive mount for a circuit board, circuit board...

Circuit board apparatus

Lead-free solder process for printed wiring boards

Method of manufacturing a surface mountable power supply module

Patents Applicationslast 30 patents

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

INTERPOSER PRINTED CIRCUIT BOARDS FOR POWER MODULES

STENCIL SET AND SYSTEM FOR PRINTING SOLDER PASTE FOR PRINTED CIRCUI...

PATTERNING METHOD AND APPARATUS FOR COMPONENT BOARDS