Thanh Lequang

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Chip scale and land grid array semiconductor packages
- Patent number 6,551,859
- Issue date Apr 22, 2003
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate strips for use in integrated circuit packaging
- Patent number 6,278,618
- Issue date Aug 21, 2001
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS