Theng Chao Long

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked transistor chip package with source coupling
- Patent number 12,094,807
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor having a lidless/laminate structure
- Patent number 11,274,984
- Issue date Mar 15, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Grant
Multi-phase half bridge driver package and methods of manufacture
- Patent number 10,396,018
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Chau Fatt Chiang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Connectable package extender for semiconductor device package
- Patent number 9,892,991
- Issue date Feb 13, 2018
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small footprint semiconductor package
- Patent number 9,666,557
- Issue date May 30, 2017
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 9,655,265
- Issue date May 16, 2017
- Infineon Technologies AG
- Tiam Meng Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Turret handlers and methods of operations thereof
- Patent number 9,594,111
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Theng Chao Long
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor die package with multiple mounting configurations
- Patent number 9,508,625
- Issue date Nov 29, 2016
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with programmable matrix for realizing configurable vert...
- Patent number 9,490,199
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Theng Chao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing a semiconductor de...
- Patent number 9,484,280
- Issue date Nov 1, 2016
- Infineon Technologies Austria AG
- Tiam Meng Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Turret handlers and methods of operations thereof
- Patent number 9,274,163
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Theng Chao Long
- G01 - MEASURING TESTING
Information Patent Grant
Molded semiconductor package with pluggable lead
- Patent number 9,153,518
- Issue date Oct 6, 2015
- Infineon Technologies AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...
- Publication number 20220278085
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Chau Fatt CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
- Publication number 20220122906
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Sergey YUFEREV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor
- Publication number 20210025774
- Publication date Jan 28, 2021
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- G01 - MEASURING TESTING
Information Patent Application
Multi-Phase Half Bridge Driver Package and Methods of Manufacture
- Publication number 20190164873
- Publication date May 30, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connectable Package Extender for Semiconductor Device Package
- Publication number 20180102300
- Publication date Apr 12, 2018
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connectable Package Extender for Semiconductor Device Package
- Publication number 20150348864
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150342073
- Publication date Nov 26, 2015
- INFINEON TECHNOLOGIES AG
- Tiam Meng PON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTIPLE MOUNTING CONFIGURATIONS
- Publication number 20150279757
- Publication date Oct 1, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer with Programmable Matrix for Realizing Configurable Vert...
- Publication number 20150249047
- Publication date Sep 3, 2015
- INFINEON TECHNOLOGIES AG
- Theng Chao Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS
- Publication number 20150214179
- Publication date Jul 30, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Multiple Contact Clips
- Publication number 20150214189
- Publication date Jul 30, 2015
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20150200148
- Publication date Jul 16, 2015
- Infineon Technologies Austria AG
- Tiam Meng PON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package with Pluggable Lead
- Publication number 20150061140
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small Footprint Semiconductor Package
- Publication number 20140353766
- Publication date Dec 4, 2014
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Turret Handlers and Methods of Operations Thereof
- Publication number 20140239998
- Publication date Aug 28, 2014
- INFINEON TECHNOLOGIES AG
- Theng Chao Long
- G01 - MEASURING TESTING

Theng Chao Long

Person

Patents Grantslast 30 patents

Stacked transistor chip package with source coupling

Pressure sensor having a lidless/laminate structure

Multi-phase half bridge driver package and methods of manufacture

Connectable package extender for semiconductor device package

Semiconductor device having multiple contact clips

Small footprint semiconductor package

Electronic module

Turret handlers and methods of operations thereof

Semiconductor die package with multiple mounting configurations

Interposer with programmable matrix for realizing configurable vert...

Semiconductor device and method of manufacturing a semiconductor de...

Turret handlers and methods of operations thereof

Molded semiconductor package with pluggable lead

Patents Applicationslast 30 patents

METHOD FOR CONNECTING AN ELECTRICAL DEVICE TO A BOTTOM UNIT BY USIN...

STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING

Pressure Sensor

Multi-Phase Half Bridge Driver Package and Methods of Manufacture

Connectable Package Extender for Semiconductor Device Package

Connectable Package Extender for Semiconductor Device Package

Electronic module and method of manufacturing the same

SEMICONDUCTOR DIE PACKAGE WITH MULTIPLE MOUNTING CONFIGURATIONS

Interposer with Programmable Matrix for Realizing Configurable Vert...

SEMICONDUCTOR DEVICE INCLUDING FLEXIBLE LEADS

Semiconductor Device Having Multiple Contact Clips

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

Molded Semiconductor Package with Pluggable Lead

Small Footprint Semiconductor Package

Turret Handlers and Methods of Operations Thereof