Theodore G. Tessier

Person

Crystal Lake, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building vertical pillar interconnect
- Patent number 9,627,254
- Issue date Apr 18, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating using dielectric bridges
- Patent number 9,070,747
- Issue date Jun 30, 2015
- FlipChip International LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,754,524
- Issue date Jun 17, 2014
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level applied thermal heat sink
- Patent number 8,686,556
- Issue date Apr 1, 2014
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,143,722
- Issue date Mar 27, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging for optoelectronic devices
- Patent number 7,091,469
- Issue date Aug 15, 2006
- ST Assembly Test Services Ltd.
- Dean Paul Kossives
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coupling substrates and structure
- Patent number 6,022,761
- Issue date Feb 8, 2000
- Motorola, Inc.
- Melissa E. Grupen-Shemansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smartcard and method of making
- Patent number 5,892,661
- Issue date Apr 6, 1999
- Motorola, Inc.
- John W. Stafford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional semiconductor package having flexible appendages
- Patent number 5,789,815
- Issue date Aug 4, 1998
- Motorola, Inc.
- Theodore G. Tessier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of packaging
- Patent number 5,661,088
- Issue date Aug 26, 1997
- Motorola, Inc.
- Theodore G. Tessier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser etch-back process for forming a metal feature on a non-metal...
- Patent number 5,221,426
- Issue date Jun 22, 1993
- Motorola Inc.
- Theodore G. Tessier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon etching process using polymeric mask, for example, to form...
- Patent number 5,217,568
- Issue date Jun 8, 1993
- Motorola, Inc.
- Theodore G. Tessier
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS
- Publication number 20160268223
- Publication date Sep 15, 2016
- Flipchip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING USING DIELECTRIC BRIDGES
- Publication number 20150001684
- Publication date Jan 1, 2015
- FlipChip International, LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED RF SHIELDS
- Publication number 20130093067
- Publication date Apr 18, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED THERMAL HEAT SINK
- Publication number 20130087904
- Publication date Apr 11, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
- Publication number 20120146219
- Publication date Jun 14, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
- Publication number 20110003470
- Publication date Jan 6, 2011
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
- Publication number 20080083986
- Publication date Apr 10, 2008
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging for optoelectronic devices
- Publication number 20050258216
- Publication date Nov 24, 2005
- Dean Paul Kossives
- H01 - BASIC ELECTRIC ELEMENTS

Theodore G. Tessier

Person

Patents Grantslast 30 patents

Methods for forming pillar bumps on semiconductor wafers

Method for building vertical pillar interconnect

Electroplating using dielectric bridges

Wafer-level interconnect for high mechanical reliability applications

Wafer level applied thermal heat sink

Wafer-level interconnect for high mechanical reliability applications

Packaging for optoelectronic devices

Method for coupling substrates and structure

Smartcard and method of making

Three dimensional semiconductor package having flexible appendages

Electronic component and method of packaging

Laser etch-back process for forming a metal feature on a non-metal...

Silicon etching process using polymeric mask, for example, to form...

Patents Applicationslast 30 patents

METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS

ELECTROPLATING USING DIELECTRIC BRIDGES

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

WAFER LEVEL APPLIED RF SHIELDS

WAFER LEVEL APPLIED THERMAL HEAT SINK

WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS

Packaging for optoelectronic devices