Theron L. Lewis

Person

Rochester, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shape-memory alloy lock for connectors
- Patent number 12,100,910
- Issue date Sep 24, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid socket warp indicator
- Patent number 11,906,574
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit rework method
- Patent number 11,742,602
- Issue date Aug 29, 2023
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material detection through compression
- Patent number 11,733,154
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Grant
Electromagnetic shielding of heatsinks with spring press-fit pins
- Patent number 11,699,884
- Issue date Jul 11, 2023
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering of end chip components in series
- Patent number 11,641,717
- Issue date May 2, 2023
- International Business Machines Corporation
- John R. Dangler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-vibration fixturing system for nondestructive testing
- Patent number 11,555,793
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,456,548
- Issue date Sep 27, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press-fit insertion method
- Patent number 11,424,562
- Issue date Aug 23, 2022
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detecting and correcting deficiencies in surface conditions for bon...
- Patent number 11,268,809
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jennifer Bennett
- G01 - MEASURING TESTING
Information Patent Grant
Tool for shaping contact tab interconnects at a circuit card edge
- Patent number 11,245,238
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Timothy P. Younger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stutter step press-fit connector insertion process
- Patent number 11,211,760
- Issue date Dec 28, 2021
- International Business Machines Corporation
- Timothy Jennings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sinks using memory shaping materials
- Patent number 11,175,100
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Theron L. Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dye and pry process for surface mount technology dual in-line memor...
- Patent number 11,166,401
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Grant
Barrier for hybrid socket movement reduction
- Patent number 10,834,839
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient placement of grid array components
- Patent number 10,756,009
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Facilitating reliable circuit board press-fit connector assembly fa...
- Patent number 10,677,856
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,593,601
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Tim A. Bartsch
- G01 - MEASURING TESTING
Information Patent Grant
Electromagnetic shielding of heat sinks with shape-memory alloy gro...
- Patent number 10,575,448
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Theron L. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dye and pry process for removing quad flat no-lead packages and bot...
- Patent number 10,262,907
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Tim A. Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate bond strength detection
- Patent number 10,073,134
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Laminate bond strength detection
- Patent number 9,910,085
- Issue date Mar 6, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component assembly
- Patent number 9,402,320
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protecting a thermal sensitive component in a thermal process
- Patent number 9,059,373
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Cliff Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a land-grid-array (LGA) interposer
- Patent number 7,975,379
- Issue date Jul 12, 2011
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket and method for compensating for differing coefficients of th...
- Patent number 7,632,127
- Issue date Dec 15, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and method for compensating for differing coefficients of th...
- Patent number 7,530,853
- Issue date May 12, 2009
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEATSINK WITH PHASE CHANGING PLUGS AND EXTINGUISHING COOLANT
- Publication number 20240306347
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Alexandra Dewey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240237210
- Publication date Jul 11, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSITIVE DATA PROTECTION
- Publication number 20240232410
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Jennifer I. Bennett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240237228
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL
- Publication number 20240194558
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Brent William Yardley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED EXTRACTION OF ELECTRONIC CONNECTOR FROM ELECTRONIC CONNE...
- Publication number 20240170903
- Publication date May 23, 2024
- International Business Machines Corporation
- Theron Lee LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240138064
- Publication date Apr 25, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY IDENTIFICATION BASED THREE-DIMENSIONAL METROLOGY
- Publication number 20230175842
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Olawunmi Akinlemibola
- G01 - MEASURING TESTING
Information Patent Application
SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS
- Publication number 20230178922
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING OF END CHIP COMPONENTS IN SERIES
- Publication number 20230061076
- Publication date Mar 2, 2023
- International Business Machines Corporation
- John R. Dangler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE MATERIAL DETECTION THROUGH COMPRESSION
- Publication number 20230048273
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Application
ANTI-VIBRATION FIXTURING SYSTEM FOR NONDESTRUCTIVE TESTING
- Publication number 20230039471
- Publication date Feb 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20230015176
- Publication date Jan 19, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SOCKET WARP INDICATOR
- Publication number 20230009784
- Publication date Jan 12, 2023
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATED PRESS-FIT CONNECTION
- Publication number 20220278470
- Publication date Sep 1, 2022
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS
- Publication number 20220029361
- Publication date Jan 27, 2022
- International Business Machines Corporation
- David J. Braun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATED PRESS-FIT CONNECTION
- Publication number 20210273355
- Publication date Sep 2, 2021
- International Business Machines Corporation
- John R. Dangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED REWORK USING LIQUID MEDIA SOLDERING
- Publication number 20210120712
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS
- Publication number 20210083410
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUTTER STEP PRESS-FIT CONNECTOR INSERTION PROCESS
- Publication number 20210075179
- Publication date Mar 11, 2021
- International Business Machines Corporation
- Timothy Jennings
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINKS USING MEMORY SHAPING MATERIALS
- Publication number 20200355442
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Theron L. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DYE AND PRY PROCESS FOR SURFACE MOUNT TECHNOLOGY DUAL IN-LINE MEMOR...
- Publication number 20200352068
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Theron Lee Lewis
- G01 - MEASURING TESTING
Information Patent Application
DETECTING AND CORRECTING DEFICIENCIES IN SURFACE CONDITIONS FOR BON...
- Publication number 20200141726
- Publication date May 7, 2020
- International Business Machines Corporation
- JENNIFER BENNETT
- G01 - MEASURING TESTING
Information Patent Application
TOOL FOR SHAPING CONTACT TAB INTERCONNECTS AT A CIRCUIT CARD EDGE
- Publication number 20200119507
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Timothy P. YOUNGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACILITATING RELIABLE CIRCUIT BOARD PRESS-FIT CONNECTOR ASSEMBLY FA...
- Publication number 20200057102
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Stephen M. HUGO
- G01 - MEASURING TESTING
Information Patent Application
DYE AND PRY PROCESS FOR REMOVING QUAD FLAT NO-LEAD PACKAGES AND BOT...
- Publication number 20190157169
- Publication date May 23, 2019
- International Business Machines Corporation
- Tim A. Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE BOND STRENGTH DETECTION
- Publication number 20180045773
- Publication date Feb 15, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING
Information Patent Application
LAMINATE BOND STRENGTH DETECTION
- Publication number 20170192051
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- G01 - MEASURING TESTING

Theron L. Lewis

Person

Patents Grantslast 30 patents

Shape-memory alloy lock for connectors

Hybrid socket warp indicator

Reliability enhancement of press fit connectors

Press-fit rework method

Thermal interface material detection through compression

Electromagnetic shielding of heatsinks with spring press-fit pins

Compliant pin surface mount technology pad for rework

Soldering of end chip components in series

Anti-vibration fixturing system for nondestructive testing

Reliability enhancement of press fit connectors

Localized rework using liquid media soldering

Press-fit insertion method

Detecting and correcting deficiencies in surface conditions for bon...

Tool for shaping contact tab interconnects at a circuit card edge

Stutter step press-fit connector insertion process

Heat sinks using memory shaping materials

Dye and pry process for surface mount technology dual in-line memor...

Barrier for hybrid socket movement reduction

Efficient placement of grid array components

Facilitating reliable circuit board press-fit connector assembly fa...

Dye and pry process for removing quad flat no-lead packages and bot...

Electromagnetic shielding of heat sinks with shape-memory alloy gro...

Dye and pry process for removing quad flat no-lead packages and bot...

Laminate bond strength detection

Laminate bond strength detection

Electronic component assembly

Protecting a thermal sensitive component in a thermal process

Method of making a land-grid-array (LGA) interposer

Socket and method for compensating for differing coefficients of th...

Socket and method for compensating for differing coefficients of th...

Patents Applicationslast 30 patents

HEATSINK WITH PHASE CHANGING PLUGS AND EXTINGUISHING COOLANT

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

SENSITIVE DATA PROTECTION

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

HEATSINK PEDESTALS FOR THERMAL INTERFACE MATERIAL FILL

CONTROLLED EXTRACTION OF ELECTRONIC CONNECTOR FROM ELECTRONIC CONNE...

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

RADIO FREQUENCY IDENTIFICATION BASED THREE-DIMENSIONAL METROLOGY

SHAPE-MEMORY ALLOY LOCK FOR CONNECTORS

SOLDERING OF END CHIP COMPONENTS IN SERIES

THERMAL INTERFACE MATERIAL DETECTION THROUGH COMPRESSION

ANTI-VIBRATION FIXTURING SYSTEM FOR NONDESTRUCTIVE TESTING

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

HYBRID SOCKET WARP INDICATOR

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

HEATED PRESS-FIT CONNECTION

ELECTROMAGNETIC SHIELDING OF HEATSINKS WITH SPRING PRESS-FIT PINS

HEATED PRESS-FIT CONNECTION

LOCALIZED REWORK USING LIQUID MEDIA SOLDERING

RELIABILITY ENHANCEMENT OF PRESS FIT CONNECTORS

STUTTER STEP PRESS-FIT CONNECTOR INSERTION PROCESS

HEAT SINKS USING MEMORY SHAPING MATERIALS

DYE AND PRY PROCESS FOR SURFACE MOUNT TECHNOLOGY DUAL IN-LINE MEMOR...

DETECTING AND CORRECTING DEFICIENCIES IN SURFACE CONDITIONS FOR BON...

TOOL FOR SHAPING CONTACT TAB INTERCONNECTS AT A CIRCUIT CARD EDGE

FACILITATING RELIABLE CIRCUIT BOARD PRESS-FIT CONNECTOR ASSEMBLY FA...

DYE AND PRY PROCESS FOR REMOVING QUAD FLAT NO-LEAD PACKAGES AND BOT...

LAMINATE BOND STRENGTH DETECTION

LAMINATE BOND STRENGTH DETECTION