THOMAS A. DEGENKOLB

Person

NOBLESVILLE, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple imager camera
- Patent number 9,621,874
- Issue date Apr 11, 2017
- Delphi Technologies, Inc.
- Daniel Leong Woon Loong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicle optical sensor system
- Patent number 9,506,803
- Issue date Nov 29, 2016
- Delphi Technologies, Inc.
- Yew Kwang Low
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 8,471,380
- Issue date Jun 25, 2013
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 8,026,597
- Issue date Sep 27, 2011
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded semiconductor power module with direct bonding and double si...
- Patent number 7,759,778
- Issue date Jul 20, 2010
- Delphi Technologies, Inc.
- Michael J. Lowry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless electrical interconnection for electronic package
- Patent number 7,621,757
- Issue date Nov 24, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around overmold for electronic assembly
- Patent number 7,616,448
- Issue date Nov 10, 2009
- Delphi Technologies, Inc.
- Thomas A. Degenkolb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical pin interconnection for electronic package
- Patent number 7,537,464
- Issue date May 26, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 7,485,957
- Issue date Feb 3, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression connection for vertical IC packages
- Patent number 7,447,041
- Issue date Nov 4, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount connector
- Patent number 7,422,448
- Issue date Sep 9, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an encapsulated microelectronic package having flu...
- Patent number 7,364,684
- Issue date Apr 29, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronics assembly and electronics package carrier therefor
- Patent number 7,324,342
- Issue date Jan 29, 2008
- Delphi Technologies, Inc.
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for manufacturing an overmolded electronic assembly
- Patent number 7,268,429
- Issue date Sep 11, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit board assembly with integrated connector
- Patent number 7,227,758
- Issue date Jun 5, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 7,205,653
- Issue date Apr 17, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic system with passive cooling
- Patent number 7,106,588
- Issue date Sep 12, 2006
- Delphi Technologies, Inc.
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-substrate circuit assembly
- Patent number 7,064,963
- Issue date Jun 20, 2006
- Delphi Technologies, Inc.
- Todd P. Oman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technique for connector to printed circuit board decoupling to elim...
- Patent number 6,905,349
- Issue date Jun 14, 2005
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic package including circuit-carrying substrate
- Patent number 6,779,260
- Issue date Aug 24, 2004
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corrosive resistant flip chip thermal management structure
- Patent number 6,560,110
- Issue date May 6, 2003
- Delphi Technologies, Inc.
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination circuit board and segmented conductive bus substrate
- Patent number 6,535,396
- Issue date Mar 18, 2003
- Delphi Technologies, Inc.
- Thomas Alan Degenkolb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VEHICLE OPTICAL SENSOR SYSTEM
- Publication number 20160076934
- Publication date Mar 17, 2016
- YEW KWANG LOW
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE IMAGER CAMERA
- Publication number 20160065940
- Publication date Mar 3, 2016
- Delphi Technologies, Inc.
- DANIEL LEONG WOON LOONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE
- Publication number 20120001319
- Publication date Jan 5, 2012
- Delphi Technologies, Inc.
- SCOTT D. BRANDENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leaded semiconductor power module with direct bonding and double si...
- Publication number 20100065950
- Publication date Mar 18, 2010
- Michael J. Lowry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20090108439
- Publication date Apr 30, 2009
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-around overmold for electronic assembly
- Publication number 20090073663
- Publication date Mar 19, 2009
- Thomas A. Degenkolb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compression connection for vertical IC packages
- Publication number 20080212296
- Publication date Sep 4, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical pin interconnection for electronic package
- Publication number 20070295450
- Publication date Dec 27, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless electrical interconnection for electronic package
- Publication number 20070295452
- Publication date Dec 27, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20070114656
- Publication date May 24, 2007
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronics assembly and electronics package carrier therefor
- Publication number 20070086163
- Publication date Apr 19, 2007
- Ralph S. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface mount connector
- Publication number 20070026700
- Publication date Feb 1, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with backplate having at least one thermal insert
- Publication number 20070004090
- Publication date Jan 4, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for manufacturing an overmolded electronic assembly
- Publication number 20060292751
- Publication date Dec 28, 2006
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20060038284
- Publication date Feb 23, 2006
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an encapsulated microelectronic package having flu...
- Publication number 20060033236
- Publication date Feb 16, 2006
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Surface mount axial leaded component for an electronic module
- Publication number 20060021792
- Publication date Feb 2, 2006
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MULTI-SUBSTRATE CIRCUIT ASSEMBLY
- Publication number 20050218505
- Publication date Oct 6, 2005
- DELPHI TECHNOLOGIES, INC
- Todd P. Oman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power electronic system with passive cooling
- Publication number 20050088822
- Publication date Apr 28, 2005
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board assembly with integrated connector
- Publication number 20050018410
- Publication date Jan 27, 2005
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filtered electrical connector assembly for an overmolded electronic...
- Publication number 20040132322
- Publication date Jul 8, 2004
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

THOMAS A. DEGENKOLB

Person

Patents Grantslast 30 patents

Multiple imager camera

Vehicle optical sensor system

Fluid cooled encapsulated microelectronic package

Fluid cooled encapsulated microelectronic package

Leaded semiconductor power module with direct bonding and double si...

Solderless electrical interconnection for electronic package

Wrap-around overmold for electronic assembly

Electrical pin interconnection for electronic package

Fluid cooled encapsulated microelectronic package

Compression connection for vertical IC packages

Surface mount connector

Method of making an encapsulated microelectronic package having flu...

Electronics assembly and electronics package carrier therefor

Technique for manufacturing an overmolded electronic assembly

Printed circuit board assembly with integrated connector

Fluid cooled encapsulated microelectronic package

Power electronic system with passive cooling

Multi-substrate circuit assembly

Technique for connector to printed circuit board decoupling to elim...

Overmolded electronic package including circuit-carrying substrate

Corrosive resistant flip chip thermal management structure

Combination circuit board and segmented conductive bus substrate

Patents Applicationslast 30 patents

VEHICLE OPTICAL SENSOR SYSTEM

MULTIPLE IMAGER CAMERA

FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE

Leaded semiconductor power module with direct bonding and double si...

Fluid cooled encapsulated microelectronic package

Wrap-around overmold for electronic assembly

Compression connection for vertical IC packages

Electrical pin interconnection for electronic package

Solderless electrical interconnection for electronic package

Fluid cooled encapsulated microelectronic package

Electronics assembly and electronics package carrier therefor

Surface mount connector

Electronic assembly with backplate having at least one thermal insert

Technique for manufacturing an overmolded electronic assembly

Fluid cooled encapsulated microelectronic package

Method of making an encapsulated microelectronic package having flu...

Surface mount axial leaded component for an electronic module

MULTI-SUBSTRATE CIRCUIT ASSEMBLY

Power electronic system with passive cooling

Printed circuit board assembly with integrated connector

Filtered electrical connector assembly for an overmolded electronic...