Thomas A. Scharr

Follow

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a flip-chip bond from a gold-tin eutectic
- Patent number 5,346,857
- Issue date Sep 13, 1994
- Motorola, Inc.
- Thomas A. Scharr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for solder removal
- Patent number 5,072,873
- Issue date Dec 17, 1991
- Motorola, Inc.
- Jay J. Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with direct-bonded external leadframe
- Patent number 4,609,936
- Issue date Sep 2, 1986
- Motorola, Inc.
- Thomas A. Scharr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated edge-protected bonding pedestals for semiconductor devices
- Patent number 4,394,678
- Issue date Jul 19, 1983
- Motorola, Inc.
- Vern H. Winchell
- H01 - BASIC ELECTRIC ELEMENTS