Thomas A. Wassick

Person

LaGrangeville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi chip hardware security module
- Patent number 11,882,645
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High bandwidth module
- Patent number 11,756,930
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth module
- Patent number 11,201,136
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging rework
- Patent number 11,121,101
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating cracking within integrated circuit (IC) device carrier
- Patent number 10,985,129
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision alignment of multi-chip high density interconnects
- Patent number 10,833,051
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressive zone to reduce dicing defects
- Patent number 10,833,025
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Kirk D. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit defect detection using pattern images
- Patent number 10,755,404
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Chung-Ching Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Step pyramid shaped structure to reduce dicing defects
- Patent number 10,636,750
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test cell for laminate and method
- Patent number 10,249,548
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Determining crackstop strength of integrated circuit assembly at th...
- Patent number 9,947,598
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact structure having stacked nickel, coppe...
- Patent number 9,853,006
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All intermetallic compound with stand off feature and method to make
- Patent number 9,793,232
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Three-dimensional integrated circuit integration
- Patent number 9,773,726
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Timothy D. Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional integrated circuit integration
- Patent number 9,515,035
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Timothy D. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing interconnect electromigration effects
- Patent number 9,477,568
- Issue date Oct 25, 2016
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayered contact structure having nickel, copper, and nickel-ir...
- Patent number 9,396,991
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant lead-free solder interconnect structures
- Patent number 9,379,007
- Issue date Jun 28, 2016
- Globalfoundries Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic coating to inhibit solder wetting on pillar sidewalls
- Patent number 9,190,376
- Issue date Nov 17, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,142,501
- Issue date Sep 22, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Under ball metallurgy (UBM) for improved electromigration
- Patent number 9,084,378
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic modulus mapping of an integrated circuit chip in a chip/dev...
- Patent number 8,650,512
- Issue date Feb 11, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective electromigration improvement for high current C4s
- Patent number 8,575,007
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having offset passivation to reduce electro...
- Patent number 8,487,447
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset solder vias, methods of manufacturing and design structures
- Patent number 8,298,929
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST
- Publication number 20240213217
- Publication date Jun 27, 2024
- International Business Machines Corporation
- David Michael Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI CHIP HARDWARE SECURITY MODULE
- Publication number 20230130104
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MODULE
- Publication number 20220059499
- Publication date Feb 24, 2022
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MODULE
- Publication number 20210288025
- Publication date Sep 16, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGING REWORK
- Publication number 20210242146
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
- Publication number 20200328177
- Publication date Oct 15, 2020
- Thomas E. Lombardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSIVE ZONE TO REDUCE DICING DEFECTS
- Publication number 20200312788
- Publication date Oct 1, 2020
- International Business Machines Corporation
- Kirk D. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS
- Publication number 20200243479
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP PYRAMID SHAPED STRUCTURE TO REDUCE DICING DEFECTS
- Publication number 20200118942
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Shidong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEFECT DETECTION USING PATTERN IMAGES
- Publication number 20190180430
- Publication date Jun 13, 2019
- International Business Machines Corporation
- Chung-Ching Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20180076101
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20170178982
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION BACKGROUND
- Publication number 20170077021
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Timothy D. Sullivan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LAYERED CONTACT STRUCTURE
- Publication number 20160307860
- Publication date Oct 20, 2016
- GLOBALFOUNDRIES INC.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit Integration
- Publication number 20160181215
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Timothy D. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CONTACT STRUCTURE HAVING NICKEL, COPPER, AND NICKEL-IR...
- Publication number 20160056072
- Publication date Feb 25, 2016
- GLOBALFOUNDRIES, Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC COATING TO INHIBIT SOLDER WETTING ON PILLAR SIDEWALLS
- Publication number 20150333025
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Managing Interconnect Electromigration Effects
- Publication number 20150094995
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140262458
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130249066
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES
- Publication number 20130252418
- Publication date Sep 26, 2013
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...
- Publication number 20120292779
- Publication date Nov 22, 2012
- International Business Machines Corporation
- MARIO J. INTERRANTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ELECTROMIGRATION IMPROVEMENT FOR HIGH CURRENT C4S
- Publication number 20120248604
- Publication date Oct 4, 2012
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES
- Publication number 20120139123
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...
- Publication number 20100233872
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Thomas A. Wassick

Person

Patents Grantslast 30 patents

Multi chip hardware security module

High bandwidth module

High bandwidth module

Flip chip packaging rework

Lead-free solder joining of electronic structures

Mitigating cracking within integrated circuit (IC) device carrier

Precision alignment of multi-chip high density interconnects

Compressive zone to reduce dicing defects

Integrated circuit defect detection using pattern images

Step pyramid shaped structure to reduce dicing defects

Lead-free solder joining of electronic structures

Test cell for laminate and method

Test cell for laminate and method

Determining crackstop strength of integrated circuit assembly at th...

Semiconductor device contact structure having stacked nickel, coppe...

All intermetallic compound with stand off feature and method to make

Three-dimensional integrated circuit integration

Three-dimensional integrated circuit integration

Managing interconnect electromigration effects

Multilayered contact structure having nickel, copper, and nickel-ir...

Electromigration-resistant lead-free solder interconnect structures

Organic coating to inhibit solder wetting on pillar sidewalls

Under ball metallurgy (UBM) for improved electromigration

Under ball metallurgy (UBM) for improved electromigration

Structures and methods to reduce maximum current density in a solde...

Elastic modulus mapping of an integrated circuit chip in a chip/dev...

Selective electromigration improvement for high current C4s

Semiconductor structure having offset passivation to reduce electro...

Structures and methods to reduce maximum current density in a solde...

Offset solder vias, methods of manufacturing and design structures

Patents Applicationslast 30 patents

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

MULTI CHIP HARDWARE SECURITY MODULE

HIGH BANDWIDTH MODULE

HIGH BANDWIDTH MODULE

FLIP CHIP PACKAGING REWORK

Mitigating Cracking Within Integrated Circuit (IC) Device Carrier

COMPRESSIVE ZONE TO REDUCE DICING DEFECTS

PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

STEP PYRAMID SHAPED STRUCTURE TO REDUCE DICING DEFECTS

INTEGRATED CIRCUIT DEFECT DETECTION USING PATTERN IMAGES

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

TEST CELL FOR LAMINATE AND METHOD

TEST CELL FOR LAMINATE AND METHOD

THREE-DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION BACKGROUND

LAYERED CONTACT STRUCTURE

Three-Dimensional Integrated Circuit Integration

MULTILAYERED CONTACT STRUCTURE HAVING NICKEL, COPPER, AND NICKEL-IR...

ORGANIC COATING TO INHIBIT SOLDER WETTING ON PILLAR SIDEWALLS

Managing Interconnect Electromigration Effects

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SEMICONDUCTOR STRUCTURE HAVING OFFSET PASSIVATION TO REDUCE ELECTRO...

SELECTIVE ELECTROMIGRATION IMPROVEMENT FOR HIGH CURRENT C4S

OFFSET SOLDER VIAS, METHODS OF MANUFACTURING AND DESIGN STRUCTURES

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...