Thomas Anand Ponnuswamy

Person

Tualatin, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 11,699,590
- Issue date Jul 11, 2023
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 11,542,630
- Issue date Jan 3, 2023
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 11,168,407
- Issue date Nov 9, 2021
- Lam Research Comporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 10,954,605
- Issue date Mar 23, 2021
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 10,930,511
- Issue date Feb 23, 2021
- Lam Research Corporation
- Jeyavel Velmurugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for achieving uniformity across a redistributio...
- Patent number 10,714,436
- Issue date Jul 14, 2020
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 10,662,545
- Issue date May 26, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper electrodeposition on cobalt lined features
- Patent number 10,648,097
- Issue date May 12, 2020
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 10,538,855
- Issue date Jan 21, 2020
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,301,738
- Issue date May 28, 2019
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for fabrication of a redistribution layer to av...
- Patent number 10,211,052
- Issue date Feb 19, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for maintaining pH in nickel electroplating...
- Patent number 10,190,232
- Issue date Jan 29, 2019
- Lam Research Corporation
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,128,102
- Issue date Nov 13, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- B08 - CLEANING
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 10,106,907
- Issue date Oct 23, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for cleaning electroplating substrate holders
- Patent number 10,092,933
- Issue date Oct 9, 2018
- Novellus Systems, Inc.
- Santosh Kumar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Automated cleaning of wafer plating assembly
- Patent number 10,087,545
- Issue date Oct 2, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for advanced packaging applications
- Patent number 9,899,230
- Issue date Feb 20, 2018
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 9,834,852
- Issue date Dec 5, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 9,828,688
- Issue date Nov 28, 2017
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Detection of plating on wafer holding apparatus
- Patent number 9,746,427
- Issue date Aug 29, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 9,613,833
- Issue date Apr 4, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 9,534,308
- Issue date Jan 3, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 9,523,155
- Issue date Dec 20, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning electroplating substrate holders using reverse current dep...
- Patent number 9,476,139
- Issue date Oct 25, 2016
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 9,455,139
- Issue date Sep 27, 2016
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for advanced packaging applications
- Patent number 9,449,808
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Bryan L. Buckalew
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Treatment method of electrodeposited copper for wafer-level-packagi...
- Patent number 9,412,713
- Issue date Aug 9, 2016
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatuses and methods for controlling PH in electroplating baths
- Patent number 9,359,688
- Issue date Jun 7, 2016
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Automated cleaning of wafer plating assembly
- Patent number 9,221,081
- Issue date Dec 29, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- B08 - CLEANING
Information Patent Grant
Copper electroplating process for uniform across wafer deposition a...
- Patent number 8,703,615
- Issue date Apr 22, 2014
- Novellus Systems, Inc.
- Thomas A. Ponnuswamy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER
- Publication number 20230212773
- Publication date Jul 6, 2023
- LAM RESEARCH CORPORATION
- Justin OBERST
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...
- Publication number 20230026818
- Publication date Jan 26, 2023
- LAM RESEARCH CORPORATION
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS
- Publication number 20220307152
- Publication date Sep 29, 2022
- LAM RESEARCH CORPORATION
- Joseph Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GOLD THROUGH SILICON MASK PLATING
- Publication number 20220216104
- Publication date Jul 7, 2022
- LAM RESEARCH CORPORATION
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LOW TEMPERATURE DIRECT COPPER-COPPER BONDING
- Publication number 20220018036
- Publication date Jan 20, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES
- Publication number 20220010446
- Publication date Jan 13, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20210151322
- Publication date May 20, 2021
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20200255964
- Publication date Aug 13, 2020
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...
- Publication number 20200115816
- Publication date Apr 16, 2020
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES
- Publication number 20190301040
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20190304789
- Publication date Oct 3, 2019
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTIBATH PLATING OF A SINGLE METAL
- Publication number 20190122890
- Publication date Apr 25, 2019
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS
- Publication number 20180371637
- Publication date Dec 27, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...
- Publication number 20180105949
- Publication date Apr 19, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...
- Publication number 20180023209
- Publication date Jan 25, 2018
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...
- Publication number 20170243839
- Publication date Aug 24, 2017
- LAM RESEARCH CORPORATION
- Bryan L. Buckalew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...
- Publication number 20170148627
- Publication date May 25, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- B08 - CLEANING
Information Patent Application
PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS
- Publication number 20170137960
- Publication date May 18, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...
- Publication number 20170029973
- Publication date Feb 2, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...
- Publication number 20170009370
- Publication date Jan 12, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20160343582
- Publication date Nov 24, 2016
- Novellus Systems, Inc.
- Bryan L. BUCKALEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...
- Publication number 20160281255
- Publication date Sep 29, 2016
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AUTOMATED CLEANING OF WAFER PLATING ASSEMBLY
- Publication number 20160145761
- Publication date May 26, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NICKEL ELECTROPLATING SYSTEMS HAVING A GRAIN REFINER RELEASING DEVICE
- Publication number 20150299882
- Publication date Oct 22, 2015
- LAM RESEARCH CORPORATION
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUSES AND METHODS FOR MAINTAINING PH IN NICKEL ELECTROPLATING...
- Publication number 20150041327
- Publication date Feb 12, 2015
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20140357089
- Publication date Dec 4, 2014
- Novellus Systems, Inc.
- Bryan L. BUCKALEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...
- Publication number 20140230860
- Publication date Aug 21, 2014
- Novellus Systems, Inc.
- Lee Peng Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION OF PLATING ON WAFER HOLDING APPARATUS
- Publication number 20140230855
- Publication date Aug 21, 2014
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TREATMENT METHOD OF ELECTRODEPOSITED COPPER FOR WAFER-LEVEL-PACKAGI...
- Publication number 20140197037
- Publication date Jul 17, 2014
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Thomas Anand Ponnuswamy

Person

Patents Grantslast 30 patents

Copper electrodeposition sequence for the filling of cobalt lined f...

Cleaning electroplating substrate holders using reverse current dep...

Copper electrodeposition on cobalt lined features

Protecting anodes from passivation in alloy plating systems

Copper electrodeposition sequence for the filling of cobalt lined f...

Systems and methods for achieving uniformity across a redistributio...

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Copper electrodeposition on cobalt lined features

Cleaning electroplating substrate holders using reverse current dep...

Methods and apparatus for wetting pretreatment for through resist m...

Systems and methods for fabrication of a redistribution layer to av...

Apparatuses and methods for maintaining pH in nickel electroplating...

Methods and apparatus for wetting pretreatment for through resist m...

Protecting anodes from passivation in alloy plating systems

Methods and apparatuses for cleaning electroplating substrate holders

Automated cleaning of wafer plating assembly

Apparatus for advanced packaging applications

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Methods and apparatus for wetting pretreatment for through resist m...

Detection of plating on wafer holding apparatus

Methods and apparatus for wetting pretreatment for through resist m...

Protecting anodes from passivation in alloy plating systems

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Cleaning electroplating substrate holders using reverse current dep...

Methods and apparatus for wetting pretreatment for through resist m...

Apparatus for advanced packaging applications

Treatment method of electrodeposited copper for wafer-level-packagi...

Apparatuses and methods for controlling PH in electroplating baths

Automated cleaning of wafer plating assembly

Copper electroplating process for uniform across wafer deposition a...

Patents Applicationslast 30 patents

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER

TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING...

BYPRODUCT REMOVAL FROM ELECTROPLATING SOLUTIONS

GOLD THROUGH SILICON MASK PLATING

LOW TEMPERATURE DIRECT COPPER-COPPER BONDING

ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...

COPPER ELECTRODEPOSITION ON COBALT LINED FEATURES

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...

MULTIBATH PLATING OF A SINGLE METAL

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...

SYSTEMS AND METHODS FOR ACHIEVING UNIFORMITY ACROSS A REDISTRIBUTIO...

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...

CLEANING ELECTROPLATING SUBSTRATE HOLDERS USING REVERSE CURRENT DEP...

APPARATUS FOR ADVANCED PACKAGING APPLICATIONS

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...

AUTOMATED CLEANING OF WAFER PLATING ASSEMBLY

NICKEL ELECTROPLATING SYSTEMS HAVING A GRAIN REFINER RELEASING DEVICE

APPARATUSES AND METHODS FOR MAINTAINING PH IN NICKEL ELECTROPLATING...

APPARATUS FOR ADVANCED PACKAGING APPLICATIONS

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...

DETECTION OF PLATING ON WAFER HOLDING APPARATUS

TREATMENT METHOD OF ELECTRODEPOSITED COPPER FOR WAFER-LEVEL-PACKAGI...