Thomas ANDERSON

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,535,623
- Issue date Jan 14, 2020
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,109,610
- Issue date Oct 23, 2018
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20160307865
- Publication date Oct 20, 2016
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS