Thomas Aquinas KIM

Person

Yongin, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate having embedded electronic component
- Patent number 11,444,043
- Issue date Sep 13, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-integrated radio frequency module
- Patent number 11,165,137
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and dual-band antenna apparatus
- Patent number 10,965,028
- Issue date Mar 30, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Ki Ryoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-integrated radio frequency module
- Patent number 10,784,564
- Issue date Sep 22, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module and dual-band antenna apparatus
- Patent number 10,770,793
- Issue date Sep 8, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Ki Ryoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-integrated radio frequency module
- Patent number 10,707,556
- Issue date Jul 7, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with heat-dissipating structure and method of...
- Patent number 10,679,955
- Issue date Jun 9, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic device module and method of measuring shielding...
- Patent number 10,622,313
- Issue date Apr 14, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Thomas A Kim
- G01 - MEASURING TESTING
Information Patent Grant
Board having electronic element, method for manufacturing the same,...
- Patent number 10,595,413
- Issue date Mar 17, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Se Jong Kim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Antenna-integrated radio frequency module
- Patent number 10,396,432
- Issue date Aug 27, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having embedded electronic component
- Patent number 10,340,234
- Issue date Jul 2, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with core substrate having a through hole
- Patent number 10,170,410
- Issue date Jan 1, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same, and electr...
- Patent number 10,068,855
- Issue date Sep 4, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package having electronic component within a f...
- Patent number 10,068,824
- Issue date Sep 4, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Thomas A Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA-INTEGRATED RADIO FREQUENCY MODULE
- Publication number 20200335851
- Publication date Oct 22, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS
- Publication number 20200112100
- Publication date Apr 9, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Ki RYOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-INTEGRATED RADIO FREQUENCY MODULE
- Publication number 20200091585
- Publication date Mar 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-INTEGRATED RADIO FREQUENCY MODULE
- Publication number 20190334224
- Publication date Oct 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT
- Publication number 20190267338
- Publication date Aug 29, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS
- Publication number 20190198995
- Publication date Jun 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Ki RYOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT
- Publication number 20180286822
- Publication date Oct 4, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-INTEGRATED RADIO FREQUENCY MODULE
- Publication number 20180212307
- Publication date Jul 26, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Hong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180197831
- Publication date Jul 12, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20180076147
- Publication date Mar 15, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD HAVING ELECTRONIC ELEMENT, METHOD FOR MANUFACTURING THE SAME,...
- Publication number 20180063961
- Publication date Mar 1, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Se Jong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE MODULE USING THE SAME
- Publication number 20180053719
- Publication date Feb 22, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170263522
- Publication date Sep 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Thomas A. KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC DEVICE MODULE AND METHOD OF MEASURING SHIELDING...
- Publication number 20170265339
- Publication date Sep 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Thomas A KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT STRUCTURE AND ELECTRONIC COMPONENT MODULE INCLUDING TH...
- Publication number 20160029486
- Publication date Jan 28, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Young Ho JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED CERAMIC CAPACITOR
- Publication number 20090161292
- Publication date Jun 25, 2009
- Samsung Electro-Mechanics CO., LTD.
- Thomas Aquinas KIM
- H01 - BASIC ELECTRIC ELEMENTS

Thomas Aquinas KIM

Person

Patents Grantslast 30 patents

Substrate having embedded electronic component

Antenna-integrated radio frequency module

Antenna module and dual-band antenna apparatus

Antenna-integrated radio frequency module

Antenna module and dual-band antenna apparatus

Antenna-integrated radio frequency module

Semiconductor package with heat-dissipating structure and method of...

Shielded electronic device module and method of measuring shielding...

Board having electronic element, method for manufacturing the same,...

Antenna-integrated radio frequency module

Substrate having embedded electronic component

Semiconductor package with core substrate having a through hole

Semiconductor package, method of manufacturing the same, and electr...

Electronic component package having electronic component within a f...

Patents Applicationslast 30 patents

ANTENNA-INTEGRATED RADIO FREQUENCY MODULE

ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS

ANTENNA-INTEGRATED RADIO FREQUENCY MODULE

ANTENNA-INTEGRATED RADIO FREQUENCY MODULE

SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT

ANTENNA MODULE AND DUAL-BAND ANTENNA APPARATUS

SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT

ANTENNA-INTEGRATED RADIO FREQUENCY MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELECTR...

BOARD HAVING ELECTRONIC ELEMENT, METHOD FOR MANUFACTURING THE SAME,...

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE MODULE USING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

SHIELDED ELECTRONIC DEVICE MODULE AND METHOD OF MEASURING SHIELDING...

SOLDER JOINT STRUCTURE AND ELECTRONIC COMPONENT MODULE INCLUDING TH...

LAMINATED CERAMIC CAPACITOR