Thomas BODNER

Person

Seiersberg, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with through-substrate via and method of manuf...
- Patent number 12,100,644
- Issue date Sep 24, 2024
- ams AG
- Bernhard Loeffler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a plurality of time-of-flight sensor devices
- Patent number 11,675,049
- Issue date Jun 13, 2023
- ams AG
- Harald Etschmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optical sensor and optical sensor
- Patent number 11,271,134
- Issue date Mar 8, 2022
- ams AG
- Gregor Toschkoff
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing a semiconductor device and semiconductor d...
- Patent number 11,139,207
- Issue date Oct 5, 2021
- ams AG
- Thomas Bodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an optical sensor at wafer-level and optical se...
- Patent number 10,943,936
- Issue date Mar 9, 2021
- ams AG
- Gregor Toschkoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package and method of producing an optical package
- Patent number 10,847,664
- Issue date Nov 24, 2020
- AMS AG
- David Mehrl
- G02 - OPTICS
Information Patent Grant
Method of producing an optical sensor at wafer-level and optical se...
- Patent number 10,734,534
- Issue date Aug 4, 2020
- AMS AG
- Harald Etschmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and arrangement for analyzing a semiconductor element and me...
- Patent number 9,991,177
- Issue date Jun 5, 2018
- AMS AG
- Helene Gehles
- G02 - OPTICS
Information Patent Grant
Method of producing a removable wafer connection and carrier for wa...
- Patent number 9,929,035
- Issue date Mar 27, 2018
- AMS AG
- Thomas Bodner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and arrangement for analyzing a semiconductor element and me...
- Patent number 9,852,955
- Issue date Dec 26, 2017
- AMS AG
- Helene Gehles
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND METHOD OF MANUF...
- Publication number 20220059434
- Publication date Feb 24, 2022
- ams AG
- Bernhard LOEFFLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES
- Publication number 20200333442
- Publication date Oct 22, 2020
- ams AG
- Harald ETSCHMAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR
- Publication number 20200313031
- Publication date Oct 1, 2020
- ams AG
- Gregor TOSCHKOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...
- Publication number 20200243387
- Publication date Jul 30, 2020
- ams AG
- Thomas BODNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATE...
- Publication number 20190237500
- Publication date Aug 1, 2019
- ams AG
- Hubert Enichlmair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...
- Publication number 20190165020
- Publication date May 30, 2019
- ams AG
- Gregor Toschkoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE
- Publication number 20180323320
- Publication date Nov 8, 2018
- ams AG
- David MEHRL
- G02 - OPTICS
Information Patent Application
METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...
- Publication number 20180226514
- Publication date Aug 9, 2018
- ams AG
- Harald ETSCHMAIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND ME...
- Publication number 20180090393
- Publication date Mar 29, 2018
- ams AG
- Helene GEHLES
- G02 - OPTICS
Information Patent Application
METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND ME...
- Publication number 20170133281
- Publication date May 11, 2017
- ams AG
- Helene RICHTER
- G02 - OPTICS
Information Patent Application
METHOD OF PRODUCING A REMOVABLE WAFER CONNECTION AND CARRIER FOR WA...
- Publication number 20150348817
- Publication date Dec 3, 2015
- ams AG
- Thomas BODNER
- H01 - BASIC ELECTRIC ELEMENTS

Thomas BODNER

Person

Patents Grantslast 30 patents

Semiconductor device with through-substrate via and method of manuf...

Method for fabricating a plurality of time-of-flight sensor devices

Method for manufacturing an optical sensor and optical sensor

Method for manufacturing a semiconductor device and semiconductor d...

Method of producing an optical sensor at wafer-level and optical se...

Optical package and method of producing an optical package

Method of producing an optical sensor at wafer-level and optical se...

Method and arrangement for analyzing a semiconductor element and me...

Method of producing a removable wafer connection and carrier for wa...

Method and arrangement for analyzing a semiconductor element and me...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA AND METHOD OF MANUF...

METHOD FOR FABRICATING A PLURALITY OF TIME-OF-FLIGHT SENSOR DEVICES

METHOD FOR MANUFACTURING AN OPTICAL SENSOR AND OPTICAL SENSOR

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR D...

3D-INTEGRATED OPTICAL SENSOR AND METHOD OF PRODUCING A 3D-INTEGRATE...

METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...

OPTICAL PACKAGE AND METHOD OF PRODUCING AN OPTICAL PACKAGE

METHOD OF PRODUCING AN OPTICAL SENSOR AT WAFER-LEVEL AND OPTICAL SE...

METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND ME...

METHOD AND ARRANGEMENT FOR ANALYZING A SEMICONDUCTOR ELEMENT AND ME...

METHOD OF PRODUCING A REMOVABLE WAFER CONNECTION AND CARRIER FOR WA...